Electronics Forum | Fri Mar 26 03:24:01 EDT 2010 | ravikumarasahitec
Hi, yes we used to see this kind of problem our customer end. This due to stencil aperture opening.these kind of issues we will overcome thorough our stencil process. please contact. ravikumar@asahitec.in
Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss
Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb
Electronics Forum | Wed Dec 14 08:06:07 EST 2005 | tk380514
Also we have just made a prototype for Wave soldered SMT components D-packs + 0603 + TSSOP�s on the bottom side with THT comp. on the top, the stencil manufacturer gave his personal library of glue stencil openings and adviced on stencil thickness wh
Electronics Forum | Mon Oct 01 02:51:24 EDT 2001 | haran
What is the main problem in running Mictor connector in SMT? What should be the stencil opening for the through hole lead?Is there any way we can eliminate touch up for the through hole lead as I understand from others that the main problem in runnin
Electronics Forum | Wed Nov 05 13:43:52 EST 2003 | swagner
I just did a bga job with square aperture's, the reasoning is for enhanced print release and additional paste volume. Be careful of the edge to edge clearance between the stencil openings, I don't recommend going below a 8 mil clearance, you could b
Electronics Forum | Wed Jan 05 17:56:30 EST 2011 | ppcbs
I am looking for a No-clean or water soluble solder paste, Sn63/Pb37 alloy, 15 - 25 microns (T5). I need to print with a 4.8 mil stencil opening. Does anyone know where I can get 250 to 500 grams in one week or less?
Electronics Forum | Fri Dec 09 11:00:47 EST 2011 | davef
Using common wire size and through hole diameter, we'd expect that the wave solder process would completely fill the through hole and that you wouldn't need to get involved in providing stencil openings, pasting the through hole or reflowing the jump
Electronics Forum | Thu Jun 28 08:24:34 EDT 2001 | Steve Vargas
Herb: Try oversizing your stencil fiducial openings to maybe twice the size of the board fiducial. When aligning manually, look for uniformity in the annular ring which appears around the fiducial. Hope this helps.....
Electronics Forum | Wed Apr 14 08:15:18 EDT 2004 | arcandspark
We have tried other stencils with different size openings but this company will not allow us time or money to run any experiments to define stencil criteria and printer settings, its just run, run, run. They really dont care about post reflow yields.
Electronics Forum | Thu Aug 16 19:56:38 EDT 2001 | davef
Awww, blank those fine tech support people at MPM. We know more than they do. Having said that, duh, umm er, please clarify the problem. * Are you concerned about paste squirting through the holes of the side 2 portion of the stencil when you are
