Electronics Forum | Thu Jan 29 15:36:33 EST 2015 | cyber_wolf
I might agree with the type that is fused to the stencil. I do not agree with buffing on the stuff on that smells exactly like rain-X. There is just not enough data.
Electronics Forum | Mon Sep 20 17:46:21 EDT 1999 | Dave F
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Mon Mar 07 06:44:39 EST 2022 | SMTA-64386201
We previously labelled PCBs after assembly but before AOI. Now we need to trace panels during assembly as well, so have the need to apply labels before the assembly process starts. Our stencils are thus not stepped to accommodate labels. I suppose t
Electronics Forum | Thu Apr 20 14:33:18 EDT 2006 | dirk29
We had that problem with our printers we just drill and tap the top end of the stop and put a short screw in to allow us to adjust the top height of the stop and catch the board. Be careful not to make it to long or to could restrict the board from l
Electronics Forum | Fri Oct 31 14:09:07 EDT 2014 | wbrenner
Having a problem with a DEK printer. In the back to front motion, getting poor ramdom paste volume on micro BGA pads. Other BGA 1 mm pads are fine. The front to back motion is fine. Any throufghts on this directional issue. Ran ~200 panels no pr
Electronics Forum | Thu May 18 10:20:55 EDT 2006 | slthomas
Russ asks good questions and I think Chunks pretty much nailed it. Aspect ratio (aperture width/stencil thickness) s/b 1.2 minimum (I like 1.5 if I can get it). If your aperture width = lead width (.008"), yours is 1. Tough to get consistent paste r
Electronics Forum | Sun Mar 06 20:08:38 EST 2005 | mrduckmann2000
Davef, You have a good question. If we had perfect design engineers out there that would use the proper component spacing and not put SMT parts between and around thru-hole parts - glue and wave would work perfectly. I have done this with great su
Electronics Forum | Mon Apr 24 09:43:47 EDT 2006 | printerman
What you describe is the X snuggers fitted into the workholder which do need either a flat board or good vacuum to work. There are several solutions. One solution you can try yourself is to use Vacuum cups, ( bellows type) designed into the workholde
Electronics Forum | Wed Mar 23 11:40:21 EDT 2022 | SMTA-64388039
In my experience a distance of 30 mils per 1 mil in height above PCA nominal is sufficient for the squeegee blade to bend (in the direction of squeegee travel) so that you don't have excessive solder issues near the label. Labels are about 5 mils ta
Electronics Forum | Thu Aug 19 12:01:26 EDT 2004 | erhard
We want to get a process running to print paste with a thicker plastic stencil with some room left underneath for preassembled components. I know DEK offers these stencils but since we are using an MPM printer they don't want to sell to us stencils f
