Electronics Forum | Fri Dec 09 15:10:55 EST 2011 | davef
Can you use the equipment manual as the basis for learning how to use the machine? Each model of printer has different alignment techniques. We don't have a clue of your model type. So, we'll approach the question from its most basic point. Registe
Electronics Forum | Wed Apr 19 20:33:14 EDT 2006 | davef
I just flew in from (insert city) and boy are my arms tired. pr: Likely, you're correct. The "pound-inch" units should have been the give-away, for us. Good catch. If this is the case, the frame fabricator would be the best source for tensioning
Electronics Forum | Tue Jan 28 07:33:59 EST 2020 | stephendo
Why not get stencils in frames? I think that is how most of us do it.
Electronics Forum | Wed May 20 10:00:00 EDT 1998 | EFData
The quick frame does work well with the DEK 265, but we feel that tensioning is user dependent and introduces variation into the process on an operator to operator basis. Also, because tensioning occurs only on two sides (instead of four) this also i
Electronics Forum | Thu Dec 29 14:06:38 EST 2005 | elias67
James, The problem is probably the result of a low quality thin walled frame. The company that originally came up with this design uses a 1/8 " wall frame. This frame does not bow at the standard 40 Ncm tension. There are thinner walled "knock off
Electronics Forum | Wed Jan 29 18:31:06 EST 2020 | slthomas
The 4 places I've worked in SMT all had their own solutions for their own reason. I quit worrying about what worked best if what I had worked OK. I've only seen (or recognized, at least) tension issues on foils that had been saved well beyond a rea
Electronics Forum | Wed Apr 04 07:29:33 EDT 2001 | zam_bri
I'm writing the procedure for buying off the stencil. Can someone help to guide me on the most effective way of doing this job. Other than tension, mylar matching, dimensional checks, what are things that I need to consider. Pls help & thank you in a
Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane
i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red
Electronics Forum | Sat Jan 11 09:56:15 EST 2020 | jakapratama
There's a lot of parameters to consider in defining stencil life cycle. Average squeegee pressure used, in-process cleaning frequency (auto and manual), physical appearance over time, tension reading over time, and so on to decide how many print cycl
Electronics Forum | Sun May 23 15:12:59 EDT 1999 | JohnW
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
