Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef
IPC-TM-650 TEST METHODS MANUAL Number 2.4.21.1 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials
Electronics Forum | Thu Nov 03 12:48:14 EST 2005 | Rosewood
We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull streg
Electronics Forum | Thu May 28 15:54:45 EDT 2009 | elmerito
Hello, We have designed a 160ball bga substrate. Now we want to use the same substrate for the 145ball version of the product. All are the same, the package size, ball pitch, solder ball size only the number of balls will change. We will use a new s
Electronics Forum | Wed Jan 09 01:50:04 EST 2019 | sarason
Which country are located in, for instance I know a company near me that doe have one of these machines and a mydata line setup for small volume and prototyping. Second question why cant your substrate be supported and than printed. I have worked at
Electronics Forum | Thu Apr 14 17:24:06 EDT 2022 | cbart
depends on board finish and PCB substrate materials. If you were using OSP or silver finished bare boards the time to process is less than an ENIG or HASL finished. certain substrate material absorb more moisture than others or at a quicker rate. so
Electronics Forum | Thu Oct 26 14:41:33 EDT 2000 | Derek Vanditmars
We are planning on replacing a SMT 100Pin QFP with a COB module that will have two dies that are functionaly equivalent to the old part that will not be available. Questions: 1)Suggestions on substrate material FR-4 or something better? 2)Are there d
Electronics Forum | Mon Feb 19 11:25:07 EST 2001 | markt
I am currently cleaning solder paste and adhesive stencils and misprinted substrates manually by using IPA, chem wipes, Q-tips, etc. Can you recommend a machine and chemistry that will clean all these applications?
Electronics Forum | Wed May 09 17:26:57 EDT 2001 | davef
Awww, don beso tuff on ursef!!! It sounds like you�re thinking correctly with what you�ve done, but it�s possible that the test you ran did not represent your actual production environment as well as you would have liked. So, you just need to "cran
Electronics Forum | Thu Jan 06 15:39:57 EST 2000 | Mike Naddra
Jim, The use a a teflon substrate, would mitigate the TCE mismatch you are expierencing. Mike
Electronics Forum | Tue Oct 12 11:40:44 EDT 1999 | Mario
Looking for any information regarding the manufacturing process of a smartcard from substrate to soldering to plastic coating etc. Any info would be appreciated Thanks Mario