Electronics Forum | Mon Mar 10 09:19:15 EDT 2008 | lysik
As you know 90% of defects come from the printer. This product is well worth the investment. You will improve yeilds and reduce rework. Very important with micro BGA's. Also lead free components do not self center (during reflow) as well. There is ve
Electronics Forum | Mon Jun 16 23:57:47 EDT 2008 | grantp
Hi, How has it worked for you with small parts such as 0402, and are you using these size parts, and getting any tomb-stoning problems? We used lead paster with our vapor phase, while lead free should have less surface tension, so I have always won
Electronics Forum | Tue Mar 31 08:11:51 EDT 2009 | davef
Solder ball formation can be a significant problem if the balls get trapped in the smaller spaces between ceramic chip carriers and substrates or possibly between the leads of small pitch leaded ICs. The solder balls also reduce the solder volume ava
Electronics Forum | Sun Jan 31 18:05:30 EST 2010 | davef
Questions are: * What kind of oil is this? Where did it come from? * In olden days, we used to pour oil on the wave solder pot to limit dross formation and loosen-up the solder. Miss that stuff, sigh. * Is there oil under the BGA? It's surface ten
Electronics Forum | Thu Feb 25 14:06:56 EST 2010 | CL
Good Afternoon Duane, Surface tension should be adequate to hold the smaller BGA's during second side reflow. You will need to ensure that nothing comes in contact with the parts during reflow. I have added a chipbonder adheasive at the edge of some
Electronics Forum | Thu Dec 09 07:21:10 EST 2010 | scottp
You won't have 2 mil height because the solder doesn't remain brick shaped. It's a dome. In the past I tried doing some calculations using the formula for the volume of a spherical section and also tried using a simulation program that accounts for
Electronics Forum | Wed Nov 13 15:33:08 EST 2013 | mondalaci
Good question :) I'd say with a machine that is available for an average pick and place operator nowadays. Our manufacturer is not fixed yet, that's why I don't have any specific. On a related note I'm wondering whether the machine is so importan
Electronics Forum | Mon Aug 24 22:27:52 EDT 2015 | sarason
Your solder looks like it hasn't had time to reflow. Are`the pictures of an aluminium substrate ? So just positing a theory your boards need more soak time, the solder seems to have formed little hills/mountains and then cooled off before the surface
Electronics Forum | Fri Apr 26 05:50:54 EDT 2019 | ppcbs
We just apply tacky flux to the surrounding components and to the bottom side components under the BGA. This will prevent cold solder if any solder joints reach reflow temperature the surface tension will keep them aligned and in place. If you nee
Electronics Forum | Fri Jul 21 01:50:04 EDT 2023 | auriga2001
The purpose is explained in the program 'help' - 'contents' menu. Due to viscosity and adhesion of different fluxes, paste may stick to the stencil more than the board. Using steps allows the surface tension and gravity to pull the paste down; rather
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