Electronics Forum: tenting vias (Page 9 of 15)

PCB Standards

Electronics Forum | Wed Jun 10 15:10:55 EDT 1998 | Rich

I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over c

Pad Design

Electronics Forum | Mon Apr 16 12:31:27 EDT 2001 | mparker

If, after all the good advice already given, the engineer insists on following his wacky design, you may still be able to influence some success. First you have the fab house plug the via holes with solder then you make sure that the bottom side of

Tenting via(s) under BGA & CSP?

Electronics Forum | Fri Apr 12 17:22:47 EDT 2002 | davef

First, splitting hairs on parlance. * Conformal Coating. A thin electrically nonconductive protective coating that conforms to the configuration of the covered assembly to provide environmental and mechanical protection. * Solder Mask. Coating mate

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Sat Dec 02 10:23:47 EST 2017 | tomh

Have you ever heard of "Solder Mask Defined Thermal Pads"? I wrote a short blurb on this here - https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html This technology saves fabrication costs by not havi


Electronics Forum | Fri Jul 09 16:32:35 EDT 1999 | John

Thanks everyone. I appreciate the help. John | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | Q #2) When speaking of annular


Electronics Forum | Thu Oct 01 11:40:17 EDT 1998 | Justin Medernach

Are there anyone who can give me the answer about solder ball problem? | We have 12 layer PCB and double sided PCB. After one side reflow soldering We found lots of solder ball under the PCB. The solder ball was coming out from via hole. | So

Re: unsoldered joints

Electronics Forum | Tue Sep 22 09:07:02 EDT 1998 | Steve Gregory

Hi Jacqueline! Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? If that is true, are there many vias concentrated aroun

Re: Micro-BGA soldering

Electronics Forum | Mon Jul 26 18:05:18 EDT 1999 | ScottM

| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F

Fiducial Recognition

Electronics Forum | Sat Aug 21 02:16:42 EDT 2010 | isd_jwendell

I do not have a QSP-2, but build boards where others have done the layout. Some have not included fiducials, and I am left finding other things. Some boards have complete tenting over the vias, so not all PTH pads will work. Drill holes are not as ac

Soldermask color relating to thickness

Electronics Forum | Fri Nov 22 16:19:45 EST 2019 | davef

I'd guess ... + Pads have no solder mask, clear or otherwise. + Pads won't take solder, because you're trying to solder to nickel. + Nickel on the pads is oxidized and is sticking out its tongue at the flux you're using. + Something went south

tenting vias searches for Companies, Equipment, Machines, Suppliers & Information