Electronics Forum | Tue Aug 21 19:24:15 EDT 2012 | rway
Checksum will work if all your doing is analog/passive testing. Checksum systems do not have digital test capability. I would recommend a Teradyne z18xx system. We use 8 of them in our plant and have been for years. Used, these systems range from
Electronics Forum | Mon Aug 27 08:22:39 EDT 2012 | rway
Dan_ems wrote, "I already build such a system with hardware and software from National Instruments. I think is the best solution because you can buy for the start only a Multimeter (DMM), a multiplexer and a software. Is very easy to do the programmi
Electronics Forum | Mon Dec 28 09:24:41 EST 1998 | Mike Zurn
Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be helpfu
Electronics Forum | Mon Feb 21 20:15:49 EST 2022 | arminski
since IPC-J-STD-001 RevH obsoleted the 1.56ug/cm2 UCL of ionic contamination tester in testing using ROSE test, how do you define the acceptable limit per PCB assembly? thanks
Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway
As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa
Electronics Forum | Wed Jul 21 10:11:57 EDT 1999 | Mark Quealy
| | Dear all | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | Our appliocation is Mainly fabrication of mother boards. | | Thanks | | | In theory, ICT is the classical answer (In-Circuit Test).
Electronics Forum | Fri Mar 26 15:17:30 EDT 2010 | jooh
Thanks for your replies! So what I understand is that ICT in reality is "only" a production process safety net, but it's a net that in most practical cases is needed. What ICT can not catch is (all) bad solder joints. What are the methods to find t
Electronics Forum | Tue Nov 01 13:35:29 EDT 2011 | jwanderl
With TestJet technology, if we want to test a 64 pin BGA, would we need probe access to each net of the device to get full coverage? If not, would I only get coverage to the pins that have probe access? In a nut shell, How exactly does it work?
Electronics Forum | Wed Jul 21 01:52:40 EDT 1999 | Scott McKee
| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | In theory, ICT is the classical answer (In-Circuit Test). In practic
Electronics Forum | Mon Oct 25 12:35:17 EDT 1999 | Steven Willett
I'm interested in anyones experience in simultaneous RF testing of multiple assemblies in a Continuous Flow Manufacturing (CFM) environment. Issues include board handling, shielding, fixture constuction and probing options.