Electronics Forum | Wed Sep 29 04:33:35 EDT 1999 | Earl Moon
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Thu Sep 03 18:48:52 EDT 1998 | Pete Sorenson
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Fri Jun 25 17:33:17 EDT 2004 | davef
Nonductile fracture!!! Sounds peculiar. In that case, stop wasting you time messing with the thermal recipe. Either your: * Components have poor solderability [test this by dipping the leads of a couple of the SSOP in your solder pot and then asse
Electronics Forum | Thu Jun 06 12:54:23 EDT 2013 | emeto
I think that you will be fine. You don't want to crack the part during it's stay on a high temperature in the reflow oven(thermal shock...thermal stress...). Once you mount the part on the board it will collect moisture again, but it is already proce
Electronics Forum | Sat Aug 21 08:00:50 EDT 2004 | davef
First, we know of no conformal coating that will help your situation. Second, as you say, companies recognize that stress testing of shippable products is NOT good practice, because it strips life from the product. So, your product is more expensiv
Electronics Forum | Sat Nov 14 08:00:34 EST 1998 | Earl Moon
| Also the preheating of the board is done to help evaporate any water/alcohol that is in the flux - water is a big problem in No-clean processes. From our experience, a temp range around 200f - no more than 220f is ideal for the bigger boards, but t
Electronics Forum | Tue Apr 27 16:21:09 EDT 1999 | Chrys Shea
| Another basic soldering question. I notice that lead-free solders have become required for plumbing applications due to legislation. In a local hardware store, I noticed the existence of lead-free solders (based upon tin-copper I think) with a me
Electronics Forum | Sat Apr 10 01:11:37 EDT 1999 | forest
Our company is going to use BGA(1.27mm pitch) But I have heard of troubles with P-BGA. It is that cracks occured between solderball and gold plating of PCB during ICT(incircuit test). We know that gold plating of PWB is not good for BGA, so we decide
Electronics Forum | Thu Jun 25 09:37:48 EDT 1998 | Russ Miculich
The real causes of microcracking are not normally due to pick and place - particularly if you are using a piece of equipment with vacuum pick up and release. The real cause of microcracking is due to thermal stresses on the die and the choice of the
Electronics Forum | Thu Sep 02 16:52:31 EDT 1999 | Earl Moon
| | | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | | | What I'm really after is anything describing how close a screw/washer/nut
.gif)
