Electronics Forum: tombstones and flex (Page 9 of 9)

Can anyone tell me that between Mirtek & Kohyoung which AOI machine will be better and why?

Electronics Forum | Tue Feb 24 03:36:37 EST 2015 | jlawson

Also should look at Viscom 3088Flex Ultra if after AOI with 3D capability. The camera optics module has many innovative features, super fast data capture - much faster then Mirtek and KohYoung. Both these companies have taken 3DSPI and turned into AO

Flex embedded into FR4

Electronics Forum | Thu May 29 10:42:40 EDT 2003 | swagner

So is it fair to say that on a moisture laden double sided flex circuit you could see an increase in tombstoning on the 2nd pass due to warpage created by delamination? In other words a 0603 for instance could tombstone due to the delaminated surfac

Flex Circuits reflowing

Electronics Forum | Wed Jul 16 09:55:05 EDT 2003 | swagner

To answer the first post after my initial response we haven't published any of our lead free data since it is proprietary, sorry. As for the nitrogen cabinet it has been proven that over time the Gold plating can build up a layer of oxides that can

Re: 2% silver solder paste

Electronics Forum | Tue Apr 13 17:44:29 EDT 1999 | Christopher Lampron

| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to

Re: Cracked Capacitors

Electronics Forum | Thu Jun 17 10:37:42 EDT 1999 | Brian Wycoff

| | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from

Re: Cracked Capacitors

Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland

| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr

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