Electronics Forum | Mon May 07 16:49:59 EDT 2001 | davef
Ashok, What in earthly heaven does this question have to do with "site support"? You can�t always get what you want, but sometimes you get what you need. Some leads are: * The proposed IPC cable/wire harness document is now IPC/WHMA-A-620 and go
Electronics Forum | Thu Jun 01 21:54:00 EDT 2000 | Dave F
Jeremy: Standards: � A-600 talks about percentage of solder mask loss allowed, according to the location (eg, laminate, bare copper, gold or nickel, melting metals) and equipment class. � A-610 talks to "Solder Resist Coating - Voids & Blisters" by
Electronics Forum | Wed Mar 29 09:39:45 EST 2000 | JAX
Garo, Minor voiding in Ball Grid Array solder joints is common, and not considered a threat to reliability. The biggest cause of open solder joints caused by voids is the outgassing of moisture. They are formed when pockets of gas are trapped durin
Electronics Forum | Sun Nov 21 13:48:16 EST 1999 | Steve Thomas
We're going to 5 mil foil from 6 mil, with a 10 mil aperture, radiused corners. Supposedly going to traps. from right angles, but who knows? We've got temp. controlled at ~73F, but no RH control. We are going to also try out a more humidity toleran
Electronics Forum | Sat Nov 27 10:16:38 EST 1999 | Steve Thomas
The new design resulted in much better release characteristics. We are quite satisfied. By the way, he says he can cut dead nuts 90 degree walls on the apertures, or traps. I didn't ask what the wall angle was, nor have I seen any recommendations,
Electronics Forum | Tue Sep 07 12:45:47 EDT 1999 | Brad Kendall
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you having a problem with the joint openning up after reflow. Like it was soldered after the reflow process, but at final test is not? I had this pr
Electronics Forum | Wed Aug 14 10:11:01 EDT 2002 | davef
For relow ovens the general approaches are: * Clean the vent pipe. * Replace [a section of ] the vent pipe. * Clean the flux trap on newer ovens. * Do nothing and wonder where that brown slime that is dripping on the boards is coming from. For wave
Electronics Forum | Thu Aug 15 15:58:12 EDT 2002 | robertnguyen
To whom this may concern, I recently ran into the problem with vias on pads of BGA when place BGA and reflow gas trap on vias escape and result in ball having void greater than 50% of BGA diameter. The BGA pad is measured at 20 mils and the vias mea
Electronics Forum | Wed Aug 21 07:24:12 EDT 2002 | bayanbaru
What is the correct method to bake or cure the component?Standard baking practise by us is to place the units into oven at 125 �C for 8 hrs directly. But I was told that the correct baking practise is to cool down the Baking Oven to Room temp and onl
Electronics Forum | Mon Sep 09 13:46:34 EDT 2002 | dragonslayr
Your lack of obvious solder balls indicates you have a decent process. However, there are still small solder balls that are free and floating on the surface of the boards prior to wash. That same solder ball is washed off and ends up in the wash solu
