Electronics Forum: trs and 5 (Page 9 of 36)

Easy and inexepnsive SMT machine?

Electronics Forum | Wed Mar 23 19:57:18 EDT 2011 | dlou87

Im sure this has been gone over before, but what the heck! We are mounting LEDs on metal core PCBs. Almost all of them have domes of silicone on top. We have some large boards (largest is 2ft x 3") Not concerned with parts/hour or fancy features.

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Wed Nov 07 21:36:17 EST 2012 | davef

Multiple process and rework thermal cycles are brutal on boards and components. Improving reliability of products through reducing thermal stress ends-up being a major driver to the interest in lower MP LF solders. Binary LF solders require the addit

Difference between NXT2 and NXT3

Electronics Forum | Mon Jan 18 02:49:03 EST 2016 | nirmex

1-Machine speed. 2-New Head H24 and DYNA Head. 3-New Feeder type W08f 4-New Part Camera. 5-New Y-Axis Flat cable design. 6-New GUI with Touch Screen. 7-Panel Height detection. 8-Feeder raising detection. 9-NPI tools support. 10-Overall machi

Solder Balls and conformal coating

Electronics Forum | Mon Apr 08 14:16:29 EDT 2019 | sever_83

We've never heard of seen of such a thing either. We tried a clean sample board and applied con coat. Same process through out and we saw nothing. After speaking with the original operators who was curing the boards he had left the boards much longer

Mydata TP9-2 and TP11-UFP difference

Electronics Forum | Thu Jul 18 17:41:31 EDT 2019 | rgduval

The UFP was a designation for "ultra-fine-pitch"; but, for the most part, you should be able to get the same placements out of both machines. Anything 0402 or above can be mechanically centered. The UFP machine will lean on optical centering for .5

Discoloring of Soldermask and silkscreen

Electronics Forum | Mon Apr 12 19:28:26 EDT 1999 | Tom B

Netters, When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? 1. Kester 293 no clean 2. 2.1 C/s for 30s to 150 C 3. .5 - .7 C/s for 60s to 185 C 4. 1.5 C/s u

repeatabilty and measurement for quality

Electronics Forum | Mon Sep 10 17:52:30 EDT 2001 | mparker

Are you doing actual measurements of the dummy parts placements? or are you just doing a visual go/no go check? If doing actual measurements, be sure to use mil inch units of measure rather than mm. Mil will give you more accurate readings. mm force

Re: Buying stenciling and pick and place equipement.

Electronics Forum | Mon Dec 20 13:39:08 EST 1999 | Wolfgang Busko

Hi Clarissa, seems to be a real start up situation you are in. For the printing there is IMO no need to buy any sophisticated automatic-vision-alignment-self-cleaning-inline-and-more-machine. Features you need: - adjustable in X-,Y-,Z-axis (individu

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect


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