Electronics Forum | Fri Jan 05 12:17:31 EST 2007 | Cmiller
Our first pass yield across all our products is above 95% but we include anything that does not meet IPC standards. Probably 75% of our failures are not electrical. AOI is a great tool to get a consistent measure of your process. I dont know how anyo
Electronics Forum | Mon May 07 11:09:49 EDT 2007 | davef
4 Fluxer Operation 4.1 Set-Up and Check-Out the Fluxer 4.1.1 Spray Fluxer Set-Up and Check-Out 4.1.1.1 Pass a sample unsoldered board through the machine. 4.1.1.2 Remove the board just after passing through the fluxer and the air knife. 4.1.1.3
Electronics Forum | Thu Feb 16 17:01:23 EST 2006 | darby
Never had anything to do with Soltec so I cannot comment on their service. However. You must realise that machine manufacturers/distributors incur a cost in storing spare parts and making them available for immediate delivery. They are not held on co
Electronics Forum | Mon Dec 05 09:04:25 EST 2011 | haiae
I just buy a used Contact 3AV machine. Afer fixed some things I think the machine can be ready to run and in fact for first time the machine power up, pass all self testing, homing is done, moving of table, heads, actuator is good, pneumatic function
Electronics Forum | Wed Apr 11 00:40:19 EDT 2012 | ngineer
I have a problem setting up the LAE on my Quad 4c. I set it up for 0805, and it seems to work, although it rejects a lot of parts, at least it places "most" of them. I tried setting up on a soic14, and could not get even one to pass. I believe I h
Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon
| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting
Electronics Forum | Tue Jan 12 21:42:33 EST 1999 | Jon Medernach
What's important in stencil printing (which differs from screen printing) is providing a consistant volume of paste at each interconnect. The process window varies in proportion to the pitch. More than 60% of all defects are related to solder depos
Electronics Forum | Tue Dec 12 15:22:50 EST 2000 | Michael Parker
Dave - the most significant difference between the two titles (that I have experienced) is the location of assignment. Usually MFG. Eng.'s are responsible to a fixed set of equipment and are more concerned with how the product acts within the machine
Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren
We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the
Electronics Forum | Thu Sep 23 06:01:16 EDT 1999 | joel cruz
| | I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts. | | | Hello, | you can get some insight by typing in double s
