Electronics Forum: two passes (Page 9 of 22)

Need help for contact 3AV (2001 YOM )

Electronics Forum | Mon Dec 05 09:04:25 EST 2011 | haiae

I just buy a used Contact 3AV machine. Afer fixed some things I think the machine can be ready to run and in fact for first time the machine power up, pass all self testing, homing is done, moving of table, heads, actuator is good, pneumatic function

Quad 4c LAE

Electronics Forum | Wed Apr 11 00:40:19 EDT 2012 | ngineer

I have a problem setting up the LAE on my Quad 4c. I set it up for 0805, and it seems to work, although it rejects a lot of parts, at least it places "most" of them. I tried setting up on a soic14, and could not get even one to pass. I believe I h

Re: BGA repair/rework

Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon

I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. Concerning the BGA stuff, I'm getting

Re: SPC on stencil printer/ what's important?

Electronics Forum | Tue Jan 12 21:42:33 EST 1999 | Jon Medernach

What's important in stencil printing (which differs from screen printing) is providing a consistant volume of paste at each interconnect. The process window varies in proportion to the pitch. More than 60% of all defects are related to solder depos

Re: career change

Electronics Forum | Tue Dec 12 15:22:50 EST 2000 | Michael Parker

Dave - the most significant difference between the two titles (that I have experienced) is the location of assignment. Usually MFG. Eng.'s are responsible to a fixed set of equipment and are more concerned with how the product acts within the machine

Immersion Silver PCB Surface Plating

Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren

We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the

Re: reflowing double sided SMT

Electronics Forum | Thu Sep 23 06:01:16 EDT 1999 | joel cruz

I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts. Hello, you can get some insight by typing in double s

Re: reflowing double sided SMT

Electronics Forum | Thu Sep 23 06:06:20 EDT 1999 | joel cruz

I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts. Hello, you can get some insight by typing in double s

Re: Solder Paste Testing

Electronics Forum | Sat Jul 24 00:31:21 EDT 1999 | Scott McKee

Has anyone ever heard of testing solder paste quality by pasting a board and making a determination of the quality by measuring paste height and width after the board is pasted. Would you consider this a valid test for solder paste testing? I ag

Re: shield placement?

Electronics Forum | Wed Apr 28 22:16:51 EDT 1999 | Steve Gregory

Hi everyone, We started our first machine placed shield test today.We will be machine placing shields with in the next two months. I used a Fuji Qp242 today. There were no problems with pickup etc,. just vision errors. I'm sure we will work the


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