Electronics Forum | Sun Feb 03 08:44:25 EST 2002 | davef
There is no standard for baking an assembled board prior to BGA rework, nor should there be. The amount of time required to bake a board varies with: * Board material. * Board construction and layers. * Board size. * Components on the board. If som
Electronics Forum | Wed Mar 06 12:24:36 EST 2002 | JasonGregory
The term is indeed "slice", Daniel. I am the 5DX engineer here in Austin, TX. To answer your question, The 5DX can slice at varying heights of virtually any solder joint. By changing certain comment lines of the NDF and RTF files, the 5DX can view th
Electronics Forum | Tue Feb 26 07:55:23 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....
Electronics Forum | Tue Feb 26 08:02:30 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....)
Electronics Forum | Thu May 02 17:00:39 EDT 2002 | gregp
I don't have Quad machines but I would like to say that all Quad machines are not manufactured by Quad. IIC, IVC, QSP-2, APS-1, QSX, AVX are Quad. CP series are Samsung. Meridian series are Mirae. The reliability and ease of use of these models may v
Electronics Forum | Fri Jul 12 03:05:30 EDT 2002 | Dreamsniper
Is there a standard with regards to the height of a PBGA ball diameter that will say that it has undergone a double drop ? What is the criteria of identifying that a PBGA solder ball has done a double drop and that it is acceptable or not acceptable.
Electronics Forum | Tue Sep 10 15:45:03 EDT 2002 | timo
Cleaning result can vary from paste vendor to vendor and even within product lines. You should check with your paste vendor for their recommendations. Your process, materials and equipment will also have a significant impact on your success. If you'
Electronics Forum | Thu Apr 10 10:54:34 EDT 2003 | pjc
It will vary by placement machine mfg. and type. I had 4x Fuji CP3 (turret chip-shooter) and 2x Fuji IP2 (split axis general app-fine-pitch)and tracked component shrinkage at 0.05%-0.5% on average. Above 0.5% triggered maint. & process eng. response.
Electronics Forum | Thu Jun 05 06:03:49 EDT 2003 | iman
Japan and Europe are the main champions for the leadfee solder initiative. USA join in due to global political efforts as one of the cub scout leaderships. Military and Automobile industrial-electronics is exempt from the leadfree directive. Reason
Electronics Forum | Fri Jun 27 11:33:50 EDT 2003 | James
I am doing the same once I get a few varies in different profiles, I set about 6 different levels and depending on board thickness and qty of large parts I go from that. It has worked well for us. Hope this helps because we also hate waiting for ano
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