Electronics Forum | Thu Aug 16 13:57:30 EDT 2001 | Hussman
Ouch! I thought that went away 12 years ago! Visual inspection to IPC standards should be used. Pulling and pushing leads is not even close to being consistent. I bet your customers or ISO auditors have never seen this practice. If they must pul
Electronics Forum | Wed Aug 01 10:28:11 EDT 2001 | btaylor
We have this problem with our High Temp. solder lines. Tombstoning is actually the term used in our facility. We found that the component termination width was a main contributor also profile ramp rates. Visual inspection will catch most of these rej
Electronics Forum | Wed Aug 01 10:28:24 EDT 2001 | btaylor
We have this problem with our High Temp. solder lines. Tombstoning is actually the term used in our facility. We found that the component termination width was a main contributor also profile ramp rates. Visual inspection will catch most of these rej
Electronics Forum | Tue Sep 22 06:07:02 EDT 1998 | jacqueline coia
need advice to point me in the correct direction for solution to the problem of unsoldered joints which look soldered under normal visual inspection, but when pull strength test is performed the leads are coming away from pad, no strong intermetallic
Electronics Forum | Fri Jul 29 19:29:21 EDT 2005 | Jason Fullerton
Per Bob Willis, the UK based guru of all things lead-free: "The only thing those swabs do effectively is lighten your wallet." Really, they don't work reliably at all. You are better off trying to do it by visual inspection. I've tried out an XRF
Electronics Forum | Tue Sep 13 09:12:12 EDT 2005 | stepheniii
I couldn't find any sanctioned procedure for dragging a pick across the leads to check for opens. I've never been a big fan of this anyways. Other than visually inspecting under a microscope and touching the leads that look suspect is there anything
Electronics Forum | Mon Feb 06 13:00:51 EST 2006 | amol_kane
Hi all, I just wave soldered 40 boards (20 if Imm Sn and 20 of Imm Ag) using SAC 305 (in this case the wave machine manufacturer (electrovert) suggested the alloy too). plan to carry out x-sectioning to see the results. overall, just from the visual
Electronics Forum | Mon Feb 20 04:59:40 EST 2006 | Loco
For visual inspection table 1-2 seems to be in order here. If you can not see the bottom using 1.8 and table 1-2, it clearly would be a defect and rework would be the only option Well, my thoughts anyway, wonder if someone has other thoughts on thi
Electronics Forum | Thu Jul 05 17:10:29 EDT 2007 | arun2382
Thanks all! I'm facing this issue with one specific batch of QFNs. It could be a plating issue. But, nothing was evident from visual inspection,No sign of voiding or non-wetting. Cross-section images of solder joints were clean as well. Could this s
Electronics Forum | Tue Feb 26 15:20:12 EST 2008 | schorschimi
The german machines use the same basic procedure as the Compact Systems CS-400E but (to my knowledge) no cut and clinch. Can you give any information about manual visual inspection after stuffing boards with such machine. If stuffing boards without
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
