Electronics Forum: voids in paste in hole (Page 9 of 17)

Voids in solder fillet

Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire

Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform

Pin in Paste assistance

Electronics Forum | Thu Dec 17 15:53:32 EST 2020 | dwl

for option 3, if you place the connectors on the first pass then flip the board, won't the protruding leads interfere with second pass stencil printing? My vote would be to overprint onto the solder mask. you can print pretty far and still have it w

Voiding in board to BGA joints

Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan

Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi

Pin in Paste assistance

Electronics Forum | Thu Dec 03 21:40:01 EST 2020 | itmconsulting

Hey Kyle - Good for you for pushing your horizons and considering pin-in-paste (aka "Intrusive Soldering"). Don't let the nay-sayers out there discourage you. When I encounter mixed tech PCBAs (SMT and through-hole) my first choice, if the design a

Solder Balls in Boards

Electronics Forum | Mon Jun 21 11:14:25 EDT 2004 | exmaintenanceleader

Dear Kanwaljit Singh, my opinion is following: 1)solderpaste type is ok - usual (alpha-metals has this problem inside the paste paste- holder problem) - what do the operator when production change -clean well the stencil holes!! no visible rest on

Re: Reg: Voids in solder bumps

Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen

Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing

Manufacturing in China, Revisited

Electronics Forum | Tue Oct 19 22:51:07 EDT 2004 | KEN

I feel it is less pressure from consumers and more from stock holder increased demands for dividends. Every quaters end our publicly traded customers go bezerk on increased orders to show increased finished goods and less component inventory. All t

Voiding in CSP Ground pad

Electronics Forum | Wed Feb 05 15:16:15 EST 2003 | davef

If the voiding is not related to entrapped air in your vias, consider trying a different paste.

Re: Voids in the joints

Electronics Forum | Mon Dec 22 16:02:22 EST 1997 | Justin Medernach

| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Vincenzo, Voids in solder joints can be caused by a number of factors. Let's begin with the flux vehicle in your soldering media. If the prope

Voids in thru-hole solder joints

Electronics Forum | Wed Nov 14 10:51:34 EST 2007 | mumtaz

Yes. Baking boards is best. Hitting the hamer on the head!


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