Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Wed May 11 20:38:18 EDT 2022 | donovan03608
The leads on the FPC are pre-tinned on both sides with SAC305. The receiving leads are AU. We do not experience any wetting issues that would suggest oxidation.
Electronics Forum | Wed May 11 20:43:42 EDT 2022 | donovan03608
The leads on the FPC are pre-tinned on both sides with SAC305. The receiving leads are AU. We do not experience any wetting issues that would suggest oxidation.
Electronics Forum | Mon Oct 27 20:01:00 EDT 2014 | rangarajd
Hello, We are facing solderability issues on a particular lot of board. THe Nickel thickness measured with an XRF is around 400 U inches. Spec calls out for 130 u inches Nickel and 3 - 5 U inches gold over it. Assuming there is no porosity on the g
Electronics Forum | Sun Jun 14 03:02:14 EDT 2020 | kylehunter
We did a batch of boards with lead free HASL that we thought was leaded. Using standard leaded paste worked, but we did have some wetting issues. The issues were resolved when switching back to leaded HASL. Can't speak to your specific fiducial issu
Electronics Forum | Mon Apr 07 11:53:44 EDT 2014 | hegemon
It's right there in front of you. Not enough overall temperature across the board. No wetting issue is evident, just looks like you need to turn up the heat, as Dave has mentioned. SOB has mentioned the issues surrounding the Electrolytic caps, ch
Electronics Forum | Thu Oct 17 21:32:28 EDT 2002 | davef
Please help to clairify the problem. Are we talking: * A pre-reflow [placement] problem? * A post-reflow [solder wetting] problem? Is the wetting issue that you mention related to the board or to the component? Please give us a little more detail
Electronics Forum | Fri Aug 30 04:53:08 EDT 2002 | jason
Hi Dr Lee, Recently, I was assigned to use Ag imm. PCB using 63/37 solder paste without Ag. The results were not fantastic. Surface finish was rough and lots of wetting issue. The oven profile soaking time was set at 70 secs above 183�C and Max tem
Electronics Forum | Fri Apr 15 14:25:57 EDT 2011 | ryanr
We've received in a batch of ICs (Xilinx FPGAs) from a customer on consignment that are having wetting issues. I believe the chips are contaminated. We also know that the chips were bought from a broker. Is there a method to remove the contamination
Electronics Forum | Thu Jan 10 11:37:43 EST 2008 | jdengler
Hi JD, We use the OM-310 NC for most of our lead free work and see some wetting issues. We also have a lead free produst that requires cleaning so we use the WS-819. It does seem to wet better although I have never tried the WS-819 on the same b
