Electronics Forum | Thu Nov 26 06:07:40 EST 1998 | Earl Moon
| I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cau
Electronics Forum | Fri Mar 05 04:39:38 EST 1999 | Pan Tian Shun
I need advise on how can bonding of ICs to flex foil be done. The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), and curre
Electronics Forum | Sat Mar 06 08:45:16 EST 1999 | Dave F
| I need advise on how can bonding of ICs to flex foil be done. | The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. | | Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), a
Electronics Forum | Wed Jun 25 06:43:06 EDT 2003 | cyber_wolf
We are currently producing a board for a customer that has about 400 gold fingers that get wire bonded after the assy. leaves our facility. We have tried many different approaches to ensure that we are not getting solder on the gold fingers. Nothing
Electronics Forum | Thu Nov 03 02:34:46 EST 2005 | Rosewood
We've recently encountered some problems with wire bond strengths. I'm looking for anybody that has had some experience with different types of substrate contamination and methods for cleaning. There is no visible contamination on the gold pads, bu
Electronics Forum | Thu Nov 03 12:48:14 EST 2005 | Rosewood
We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull streg
Electronics Forum | Thu Jul 04 23:17:24 EDT 2019 | 123456789
Today we will talk some other problems you may meet in the wedge bonding work. If you have any other supplement or suggestion, welcome to leave us message. Appear welding spot indentation on the frame, what's the causes? How to solve? 1.The Wedge’s
Electronics Forum | Thu Oct 26 17:48:47 EDT 2000 | Dave F
In response to your questions: 1) Suggestions on substrate material FR-4 or something better? Most PBGA are on BT. That might good for you, also. 2) Are there design guidelines for wire bonding pattern on the substrate? Several things: 1 Doesn�t
Electronics Forum | Wed Jul 02 03:24:35 EDT 2003 | ramanandkini
did you check with lackwere peters? My frined told me that they have some coatings for this application.
Electronics Forum | Wed Jul 02 19:20:43 EDT 2003 | teamcanada
Have you looked into Kapton tape as a protectant?
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