New Equipment | Assembly Services
Packaging System for Semiconductor and Electronic Device Flip Chip Bonder is an equipment used in the semiconductor packaging process. It is a method of connecting individual chips of wafers so that the bumps on the chip and electrodes of the substr
The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
Wire-bonding Technician: Capable of programming, repair and support automatic K&S 1419 wire bonders and MECH-EL /MEI manual bonders, among with other assy equipment. Familiarity with HYBRID assemblies in a semiconductors environment. SPC knowlege.
Industry Directory | Manufacturer
GTEK specializes in SMT, Thru Hole, prototypes; productions runs and rework assemblies for either consignment or turnkey. Also we have the capability of assembling & reworking BGA�s, doing wire bonding, cable/harness assemblies and designing your who
Career Center | Oakville, Ontario Canada | Engineering,Production,Quality Control
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety
Career Center | Oakville, Ontario Canada | Production
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety o
Industry News | 2012-03-30 18:48:18.0
Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.
The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
Industry News | 2015-08-11 09:37:25.0
Saline Lectronics now offers wire bonding in-house as an added-value service. With the installation of the Kulicke & Soffa 4500 Manual Wedge Bonder, Saline Lectronics is now one of the only electronic contract manufacturers in the Midwest to support wire bonding services.
New Equipment | Cleaning Agents
MICRONOX MX2100 is an aqueous, single-phase solvent designed to remove tough flux residue from PMIC devices including IGBT modules and power MOSFETs. MX2100 has a well-balanced formula that provides outstanding cleaning performance and metal compatib
