Electronics Forum | Thu Jan 15 15:15:25 EST 1998 | justin
| I gleen from your post that this assembly is mixed technology. You may have a compatibility problem between the flux in your wave solder machine and the flux in your solder paste. Check with the manufacturer of each and see if they interact. | |
Electronics Forum | Wed Jun 23 13:34:29 EDT 2004 | df_indy
I am four weeks into my new job, there always seems to be some issues here with PCB every week. Today while I was checking some assemblies with micro-scope, I found a lot of tiny bubbles/blisters on the board. They are just little dots if you look
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Electronics Forum | Tue Feb 19 15:59:55 EST 2002 | pjc
Surface tension is a likely cause. Surface tension is a negative wetting force. You may have a solderability problem. Be sure your flux is properly activated according to the flux mfg. top side board temp. specification. When surfaces to be soldered,
Electronics Forum | Thu Mar 23 10:02:09 EST 2006 | Joe
Check placement pressure. I agree with the "smushing" theory. If you can place the component with less pressure, I'd do that first. A switch to Type three paste is also a good idea, as long as your minimum aperture dimension remains at 0.009" as you
Electronics Forum | Thu Apr 26 10:07:06 EDT 2007 | realchunks
Hi Dub J, I have worked for a few companies that did 3D sampling and found the data they produce to be useless. In the real world they are slow, so that means you won't sample every board. Now if you're not sampling every board, and you start to r
Electronics Forum | Fri Apr 27 10:33:58 EDT 2007 | ck_the_flip
Jeremy, well said! Thanks for "validating" my theory... LOL I agree that the sampling frequency, AND methodology are key things with 3D inspection. 3D will give you some insight onto how your paste (rheology, viscosity, thixotropy)AND process are
Electronics Forum | Thu Jan 15 15:13:50 EST 1998 | justin medernach
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Thu Jan 15 17:07:18 EST 1998 | Graham Naisbitt
A reasonable assumption but it could be a reaction between your solder resist and the fluxes in the wave and reflow processes. The issue is, how will anyone really know? Then, are they likely to compromise circuit reliability? I have a method that wi
Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev
Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep
