Electronics Forum | Sun Aug 07 01:49:58 EDT 2011 | xboxhaxorz
http://intelpr.feedroom.com/?fr_story=236a12fb4342ce6a578b40e8b7121d14c0bab751 Watching this video, i was wondering which type of flux they use for cleaning and for reattachment. I was unable to find the flux they use. Shown at 4:17 4:29 8:59 If un
Electronics Forum | Thu Nov 03 00:21:10 EDT 2011 | haiae
I try to re-adjust some parameter follows your suggestion, but there is no effective result. I just find a key of problem, that is pick speed for components 0805. I just change pick speed from 3 to 4 in last week. After that the machine run well unti
Electronics Forum | Tue Nov 08 07:23:03 EST 2011 | leemeyer
Thanks Bobpan, A function 6 tells me that I have firmware ver IVC 3.05. I keep getting a motor error 4 "The Xand/or Y axis did not reach the commanded position within 500 msec." The battery was dead on this machine so the mod codes were lost. I en
Electronics Forum | Wed Jan 18 06:22:23 EST 2012 | ngineer
I rang out the bases, the connectors are common (i.e from top to bottom, 1-1, 2-2, 3-3,4-4). I also measured voltage on the connectors. Front and back don't have any voltage, and the lights don't come on when I press the buttons. Left and Right ar
Electronics Forum | Wed Apr 18 16:13:43 EDT 2012 | tomzee
Hello All. First time poster. I need to design a PCB which will include a Bumped-die type chip with 6mil (152.4 um) pad pitch. I read somewhere that FR4 type board may not be a good choice for such small footprint. I have not had to deal with board
Electronics Forum | Mon May 21 15:25:51 EDT 2012 | cbeneat
I'm having an issue with a particular board we run in our wave solder. it has a USB connector with 4 pins that are 3mm x3mm square. we are constantly getting abridge across at least two of the pins, but sometimes all 4. I've run out of ideas on ho
Electronics Forum | Thu Jun 28 09:38:14 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Thu Jun 28 09:38:20 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Fri Aug 10 18:06:52 EDT 2012 | mfergus
Anyone have experience printing solder paste for a Toshiba SSM3K15CT(TPL3) FET with CST3 package? Using 1 to 1 rectangular apertures with a 4 mil stencil and Alpha OM 338 #4 powder size lead free solder paste. Print head speed is 15 mm/sec and solven
Electronics Forum | Mon Sep 17 03:59:52 EDT 2012 | stivais
Hi guys, We have an interesting case we haven't seen before (see the picture below) http://postimage.org/image/lu2f4ae55/ Solder balls form on unpopulated pads after reflow. 1. Reflow profile is fine. 2. Stencil thickness / paste volume is also f
