Electronics Forum: pass (Page 84 of 142)

Re: BGA In-circuit Failure Analysis

Electronics Forum | Tue Jun 16 15:10:27 EDT 1998 | Bob Willis

Simple x-ray inspection works well have a word with those nice people at Nicolet or Glenbrook. One of them was featured on my x-ray training video for BGA. A procedure for inspection criteria is on my web site if it is of use. How do I mechanical

Re: Cold Welding Phenomenon

Electronics Forum | Tue Mar 10 03:01:30 EST 1998 | Pete Sorenson

Cold Welding I'm presently doing a project on reflow profiling. I came across this expression. Can someone please give me a definition. Best Regards Tom Mc Grath A cold weld is a joint between two metals produced by the application of pr

Re: Stencil Opening

Electronics Forum | Wed Feb 25 02:33:52 EST 1998 | Scott McKee

Stencil Opening Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable Ron, Use a six mil foil thickness for your stencil. Go one to one with yo

Re: Placing 160 Pin QFP on Fuji HP machine?

Electronics Forum | Wed Feb 25 23:19:41 EST 1998 | Steve Gregory

Eric, You've got a Fuji FHP? WOW! It still runs even! That was the first fine pitch machine I ever worked with, along with the FEP's and CP-2's. Unless Fuji has changed the machine software, I don't know what he may be talking about. They

Re: Double sided reflow

Electronics Forum | Fri Apr 03 03:41:04 EST 1998 | Frank J. de Klein

150 secs. On bilayer boards (Cu only at top and bottom) you can typically not reach differences top to bottom bigger then 35-40 C. For multilayers however, the maximum is 15-20 C. If you actively cool a multi- layer at the bottom during the 2nd pass,

Missing componentafter chip placer.

Electronics Forum | Fri Sep 07 14:51:36 EDT 2001 | Claude Couture

What kind/brand of machine are we talking about? Are the missing parts randomly distributed or are specific to a feeder/placement/pattern? Does your machine remember where to resume placement if you reset it in the middle of a pattern placement? We h

Inspection Equipment

Electronics Forum | Thu Sep 27 11:59:14 EDT 2001 | vance

Programming time is going to be your biggest concern with a high mix environment. This includes maintaining programs. Any time a part's appearance changes (color, location of marking, wording, etc) templates need to be modified in some way to produ

Excess Flux in uBGA rework

Electronics Forum | Tue Sep 25 13:01:48 EDT 2001 | Hussman

If the flux you are applying by brush is alcohol based, use some alcohol on a few failed PCBs and retest. It souldn't take a lot of flux to reflow the balls to a pad that's already covered with solder and flux from the first BGA - unless you are cle

Excess Flux in uBGA rework

Electronics Forum | Tue Sep 25 14:38:05 EDT 2001 | nwyatt

1. SRT has been recently calibrated - problem is too many hands in the machine and careless mistakes. The profile is good and has been recently checked by a fellow from Genrad. 2. We are relying on the left over solder from the previous joint and

BGA solder joint VS. X-Ray machine capability

Electronics Forum | Mon Nov 12 11:40:50 EST 2001 | caldon

Your broad question will bring many answers.You do not mention PCB type which plays a key part in the inspection specs you look for. Your question is like asking "What is the best automobile?" You will have 1,000,000 answers. Best answered this way:


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