Electronics Forum | Tue Sep 29 10:10:34 EDT 2015 | swag
We used to have a UP3000. Long time ago so I'm rusty but isn't there a setting for fid correction that you an program to occur after each board or after 5, 10, etc.? I thought I remembered doing offsets on ours as the camera was a little wacky (old
Electronics Forum | Tue Jan 08 08:52:30 EST 2019 | ameenullakhan
Hi Steve, We did the below trials today. 1. Run the board in O2 environment. result : Yellowish appearance was observed. After DI water Cleaning : Still the yellow color is there. 2. Same board run secondary side. Result : First side board yel
Electronics Forum | Mon Jan 20 03:50:37 EST 2020 | falconex_technician
Hi, my company bough second hand pick and place as our second machine. After first transport after start just when initializing, It's showing problem with Z calibration. After second position setup and connect again after month, now showing &
Electronics Forum | Tue Sep 05 04:19:23 EDT 2000 | P.GERARDIN
We intend to promote the new PCB cleaning process with acqueous chemistry , but we face with an important demand : Do we have to dry the pcb after ? Wich is the treshold humidity content to avoid any risk for FR4 material ? Regards Pascal
Electronics Forum | Thu Sep 02 11:50:58 EDT 1999 | ScottM
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Insufficient solderpaste. "No flux" (sat too long after print). Those are what I've experienced. Cheers, Scott
Electronics Forum | Thu Jan 07 08:13:33 EST 1999 | Earl Moon
| What kind of equipment are you using to gauge the thickness of your stencil after it's used for some months? How to determin the condition of the stencil? Your input is much appreciated. | | Ken Mok, based in Shenzhen, China. | | | Overarm micr
Electronics Forum | Mon Jul 06 18:52:10 EDT 1998 | Dave F
Aside from process flows where the next step is: 1 Powering-up an assembly 2 Testing the assembly on electronic test equipment Is there a reason (need) to dry assemblies after water washing followed by a DI water rinse? Or is air drying OK? Dave F
Electronics Forum | Wed Jun 03 17:40:52 EDT 1998 | Dave F
What methods do people use to dress pads after removing and before replacing the BGA? We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? Dave F
Electronics Forum | Tue Jul 07 19:52:09 EDT 1998 | Gary Miller
after you have removed the solder from the pads you can reapply solder psate onto the pads using a single site stencil printer from Mini Micro Stencil.
Electronics Forum | Wed Mar 18 11:53:29 EST 1998 | Mike Masters
Is there anyone out there required by their customer to clean the finget tab contacts even after using noclean paste? We have been asked to clean even though we don't have any flux residue on the contacts. Any ideas? Mike
