Electronics Forum: after (Page 89 of 658)

LED UP

Electronics Forum | Fri Sep 07 23:59:24 EDT 2018 | leohdez

I have this problem the led rises after passing through the reflow oven. Could they help me?

Rad 5 performance: bent lead

Electronics Forum | Tue Jul 09 13:57:26 EDT 2019 | daniel_marquette

Good, I came to the same conclusion after recent tests.

Re: solder balls and flux

Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F

Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is

Form tips

Electronics Forum | Wed Aug 16 18:24:58 EDT 2000 | Boca

Does anyone else have the 'form tips' pop up over and over and over and over.. well you get the idea, after looking at each form entry. This has happened many times over the last several weeks. It does this to me after I obediently check the 'don't

Re: Misplaced QFP240 component

Electronics Forum | Wed May 17 03:56:20 EDT 2000 | Wolfgang Busko

Avichai: What kind of PCB are you using, when do you detect that shift (right after placement, before reflow, after reflow), does the shift always appear to be the same or do you see a variation, are you able to identify the process-step where it hap

Re: solder balls and flux

Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F

Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is

Substrate Au/Ni thickness

Electronics Forum | Thu Feb 15 07:25:05 EST 2001 | Nick

0.5um(Ni~6.5um) after reflow(data taken in 48hrs).But after performing temperature cycle test ,the former aging rate(from the shear strength ) seems faster than the latter.Why!?Someone call this the 'precipitation hardness',but what actually is it! A

Plastic BGA

Electronics Forum | Tue Oct 24 17:01:20 EDT 2000 | Philip A. Reyes

Hi! Good day!! My questions is about PBGA rework the ff are: 1. Is it necessary to reball the plastic BGA module after removing it from the PCB? Can you give me the process and critical requirements?(e.i.stencil) 2.After removing the PBGA modul

Cracked SMT Capacitors

Electronics Forum | Wed Jun 13 16:13:54 EDT 2001 | Igmar

Have anyone seen this problem: Capacitors (100nF 0805) placed on PCB and then appear cracked after reflow. After reflow, the solder joints look visualy acceptable. Then capacitors fail during testing. When attempting to remove capacitor with hot sol

Second wave elimination

Electronics Forum | Thu Feb 03 07:19:39 EST 2000 | Hany A. Salam

Hello there: Could anyone help: 1- In a double wave wave solder M/C, is possible to completely eliminate the second wave without affecting the quality of the solder joints? 2-From a quality control prespective, what is the minimum accepted length of


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