Electronics Forum | Wed Feb 23 00:45:49 EST 2011 | tsvetan
Does someone with technical knowledge knows what exactly happend with the solder paste after the shelf life pass? What we have seen is sometimes flux separation which disapear after a good mix, and change of viscosity i.e. drying. The tin, silver and
Electronics Forum | Tue Sep 07 12:45:47 EDT 1999 | Brad Kendall
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you having a problem with the joint openning up after reflow. Like it was soldered after the reflow process, but at final test is not? I had this pr
Electronics Forum | Tue Nov 24 11:13:11 EST 1998 | Keith
| A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioni
Electronics Forum | Thu Oct 01 06:44:44 EDT 1998 | PARK KYUNG SAM
Are there anyone who can give me the answer about solder ball problem? We have 12 layer PCB and double sided PCB. After one side reflow soldering We found lots of solder ball under the PCB. The solder ball was coming out from via hole. So when w
Electronics Forum | Wed May 08 23:48:01 EDT 2002 | ianchan
Hi mates, someone told us to use mild HCL acid 5% to 10% solution and submerge the LCC parts into this solution. hopefully this will clean off the varient copper oxide layer on the LCC leadless terminal wall. after the HCL soak, submerge the parts
Electronics Forum | Mon Apr 14 12:40:28 EDT 2003 | jimcorr
They are letting you go on holiday with these problems outstanding??!! But seriously after reading about your problems I think that any further work is basically throwing good ��$$ after bad and reworking BGA almost always ensure that they will fail
Electronics Forum | Fri Jun 27 22:33:16 EDT 2003 | Ben
HI, I'm doing a dye penetrant and peel test of non-function BGA solder joints to locate the fracture surface. After applying dye, I found the dye ink just accumulate at the solder mask edge and spread everywhere after I peeled off the package. THis i
Electronics Forum | Mon Jan 19 15:33:49 EST 2004 | J Smithj
We were and still are having problems with magnetized nozzles on the HSP 4796. The problem was found when numerous parts were thrown after being placed on pad. It appeared to be picking parts up off the board after placement. Nozzles were pulled out
Electronics Forum | Thu Aug 26 13:31:05 EDT 2004 | Dreamsniper
Hi, I always caught our touch-up operators cleaning touched up boards improperly. Either by just wiping with lint free clothe the solder joints of the components after touch up or by just going behind the aqeuous cleaner and scooping some water then
Electronics Forum | Fri Sep 09 15:03:46 EDT 2005 | Amol
Hi, I am running a circuit board that needs a part to be put on it after cleaning and before conformal coating. the only problem is that after cleaning and hand assembly of the part, there is a thin whitish residue in the ckt board that one can see w
