Electronics Forum | Wed Jan 12 14:43:54 EST 2000 | JAX
Doug, Jedec has this info. Here is a few for you to use. LENGTH, L+LEADS, WIDTH, W+LEADS, PITCH, AVG. HEIGHT. 1. CQFP100AC: 17.28,22.35,17.28,22.35,.635,4.92 2. CQFP100AF: 32.52,37.59,32.52,37.59,1.27,4.92 3. PQFP100AD: 19.05,22.35,19.05,22.35,.
Electronics Forum | Tue Feb 24 18:21:52 EST 1998 | Graham Naisbitt
You should refer to the IPC-J-STD001B and IPC-TM-650, they will give you good recommendations. Also, we do new reliability test systems and if you can give me your address and e-mail, I will send you some more info. Regards, Graham Naisbitt | looking
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
Electronics Forum | Wed Feb 12 20:13:39 EST 2003 | cmiller
Does anyone have any experience with setting up a nitrogen supply system to a wave solder machine that is equiped for it? Does the nitrogen need to be room temp or higher? Does it make a big difference with bridging or solder quality? We bought a use
Electronics Forum | Mon Aug 08 06:17:09 EDT 2005 | Hi Steven
My suggest is using Ersa IR55A or IR650A. http://www.ersa.de/en/ If you looking for your quality, you need this system. I had try it many time, is better then hot air. and you can set the profile as you like, even Flat Peak on the Lead Free Rework.
Electronics Forum | Mon Sep 27 20:40:05 EDT 2004 | danhui888
Hi, You may look into PVA 650 which cost around US$40K for a unit. Let me know which company you are or which location will you be and I shall get my team to visit you and let you know more about this sysytem. Regards Danny Hui
Electronics Forum | Thu Nov 11 12:56:55 EST 2004 | JB
We are using a Hoverdavis feeder to place labels with our GSM's. The labels we are currently using are .650 x .250. We have had it for a few months now and, so far it has proven to be an excellent buy. Placing thousands of labels by hand was killin
Electronics Forum | Tue Mar 29 09:54:20 EST 2005 | chon
Indy, Please refer to IPC-TM-650 TEST METHOD MANUAL Number 2.4.21.1, this is the closest written procedure I've found and used for this. I hope helps or if someone has any other input please advise. On more thing I have this file just let me know if
Electronics Forum | Fri May 20 15:13:29 EDT 2005 | lyrtech
We don't know if our solder pot is producing too droos or not. When we get it out of the solder pot, we have to add around 50 lbs of solder bars. I think it's an important quantity. I want to know your feeling about that. We use Alpha Metal Hiflo Bar
Electronics Forum | Tue Jan 10 22:10:58 EST 2006 | davef
Muse We don't believe that the IPC TM-650 Test Methods Manual, 2.4.1E, Adhesion, Tape Testing--5/04 [ http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2.4.1E.pdf ] that you refer to is a "black pad" test. We think it's a method for testing the a
