Electronics Forum | Fri May 22 22:18:18 EDT 1998 | David Newman
Hello, I am looking for suggestions for cleaning pcb's after the routing (fabrication) process. Keep in mind that these pcb do not have components intalled on them yet. We have considered pre-drilling the routing plunge points, but cost and capacity
Electronics Forum | Wed Jun 26 08:52:03 EDT 2002 | davef
There is no industry standard for reballing BGA. Search the fine SMTnet Archives for a reference to Motorola�s reasoning behind their not shipping product with reworked BGA. As background: * JEDEC is the semiconductor engineering standardization gr
Electronics Forum | Wed May 10 12:13:16 EDT 2006 | scombs
We have a 6 up panel with a 1206 part .082" from the board scoreline. After depanelization when we run the board through ICT it fails for a short at that location. We have visually inspected at high magnification for any cracks in the body and at the
Electronics Forum | Fri Sep 21 17:33:01 EDT 2018 | michaelszuch
Hello Hai, The first step is to determine where in the process the bubbles are being generated - either during coating or during curing. You can easily check this by letting a few boards air dry (no oven) and comparing them to the oven-cured ones. I
Electronics Forum | Wed Oct 19 07:04:06 EDT 2022 | winston_one
If any changes in design is not possible and you have to solder it, it's a real headache, I know... I see only 3 options here that you can try consiquently: 1) Accurately profile the board and optimize a profile (go to lower limit of process windo
Electronics Forum | Wed Oct 19 18:47:28 EDT 2022 | winston_one
I can understand the situation, when there is now possibilitie to change board design, or something like this at the moment, and now you have to work with what you have now... Customers and management can bring a stupid situations... But I'm agree w
Electronics Forum | Mon Dec 11 20:56:29 EST 2000 | Dave F
I'm with ya John. I'm afraid I'm in brain lock on picturing the situation, mostly because of my bias against waving second side MELF. I know people do it, but we've never had good luck. It would be good if we could have a clear process flow to hel
Electronics Forum | Tue Dec 12 08:44:27 EST 2000 | Wolfgang Busko
Another theory just developed in this very moment is that the glue did for what reason ever become "liquid" to a certain degree allowing gravity to do what gravity normally does but only to a certain point where this bubble-gum-like state stopped ( w
Electronics Forum | Tue Aug 22 14:02:02 EDT 2000 | JAX
Caumel, You should be able to find sufficient info in the archives. Solder Balls probably hold the majority of posts and should be easy to referance. You can find out what causes them in relation to board material, profile tempature, wave type, flu
Electronics Forum | Tue Nov 27 12:12:53 EST 2001 | Justin
We have noticed that when you are using a no-clean flux with the wave solder process that you will have additional solderballs. One thing that we have done is to change the PCB finish to a matte finish. This has greatly reduced the number of solder
