Electronics Forum: after (Page 92 of 658)

vaccum & blow level for Juki machine

Electronics Forum | Tue Jun 14 17:10:43 EDT 2005 | peter ng

Dear all, I need some information about the Juki 750,760,2010&2020 1)actual vaccum level (with&without nozzle)-after measure 2)blow level(without nozzle)-after measure 3)Is the unit for Juki blow & vaccum level in KPA or mmHg? Thanks!

Fuji cp6 re-reading fiducials

Electronics Forum | Wed Jun 29 19:33:12 EDT 2005 | matjen

After the machine stops for any reason when restarted the z table goes to loader position comes up then goes back down and re-reads the fiducials, only one machine does this but we are losing valuable cycle time after every part change. We have Fuji

Possible to water wash no-clean solder paste boards?

Electronics Forum | Thu Jul 14 01:31:03 EDT 2005 | Ivan R

Hi Pyramus you should`t have a major problem after you wash the board as my crew also run into this problem a few month ago ,, I wash them after but I suggestto run one first it depent who is the paste from I think.

Possible to water wash no-clean solder paste boards?

Electronics Forum | Thu Jul 14 01:31:05 EDT 2005 | Ivan R

Hi Pyramus you should`t have a major problem after you wash the board as my crew also run into this problem a few month ago ,, I wash them after but I suggestto run one first it depent who is the paste from I think.

Cracked Joints & Ultrasonic Welding

Electronics Forum | Tue Nov 01 09:57:18 EST 2005 | Chris

Hi, I am experiencing cracked solder joints on ceramic resonators after the ultrasonic plastic weld process. PCB assy is placed into plastic housing and then housing halves are ultrasonic welded. Not a soldering problem. I know this component is

does copper wire become thinner when it dip to leadfree solder?

Electronics Forum | Wed Nov 02 01:24:07 EST 2005 | arnold

we are encountering a problem on our production. after dipping a copper wire AWG#30 to a leadfree solder the wire becom thinner and easily to break. does the leadfree soler has the capability to weaken the wire (lessen the diameter)after dipping to l

BGA inspection microscope

Electronics Forum | Wed Dec 14 06:18:20 EST 2005 | tk380514

right again grant, consider the fact that if you spend enough time inspecting the soldered boards/pre-oven and check the BGA solder paste pads before, and clean the stencil regularly and check solder paste dryness, check oven profiles then after chec

Conformal Coat (Urethane) & bubbles

Electronics Forum | Tue Jan 24 10:24:18 EST 2006 | kmorris

We've got a problem here, where we're hand spraying a urethane conformal coat on over a rectangular inductor. The inductor body is a plastic tube, with potting to fill. The top is not always flat (sometimes concave). The problem is that bubbles appea

Paste printing, acceptable tolerance ?

Electronics Forum | Fri May 26 08:16:14 EDT 2006 | Chunks

This could be what we call a "non-problem". If your print is off slightly, yet after reflow there is no solder related defects, it should be considered OK. Move your inspector from the printer to right after the oven. This would enable them to ins

Paste printing, acceptable tolerance ?

Electronics Forum | Wed Jun 07 22:33:50 EDT 2006 | Bolos

first: what is your problem after reflow? second: a good rule of thumb is a tolerance of 1 mil. for example..if you got 5 thou stencil thickness then your range of thickness is 6-/+1 thou.. then you just improve after you get your height data and ana


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