Electronics Forum | Mon Jun 19 10:30:30 EDT 2023 | smtusa
Jet printing can reach 80um, whereas contact dispensing is 0.3mm I believe. 0402 pads are 0.6x0.5mm.
Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech
Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch
Electronics Forum | Tue Jun 20 20:31:12 EDT 2000 | Dave F
Chrys you're fine. On scoring: * Be sure spec material remaining, not what is removed. * Be sure that the v-grooves are perpendicular to each other, not off set. * Typ spec for for .062 thick boards FR-4 0.018-0.024 MC-3 0.030-0.040 * HADCO recomm
Electronics Forum | Tue Aug 28 14:21:39 EDT 2001 | Scott B
You have to be careful here. The figure is expressed as placement accuracy, not process quality therefore 3 sigma does not relate to 2700 PPM defects but 2700 parts per million placed outwith 15microns (0.0006" / 0.6thou). Extrapolating the distribu
Electronics Forum | Fri Aug 06 03:51:06 EDT 1999 | Thomas
Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. My regular stencil manufacturer recommend the following: Thickness: 8 mils 0805 opening: Oblong 0.35 X
Electronics Forum | Wed Jul 13 19:47:06 EDT 2005 | Darby
This works for me with ENIG finish and a SAC305 NC paste Reduce all pads by -2mil on all sides ie 0.050" x 0.050" becomes 0.046" x 0.046" EXCEPT Anything smaller than 30mil; -1.5mil Anything smaller than 20mil; -1mil Anything smaller than 15mil;
Electronics Forum | Thu Feb 10 10:49:26 EST 2000 | Sal
The connectors are well within thier specification,and are also checked for misaligned and damaged pins , as regards the cross-section results, all holes are correctly aligned and are well spaced within their tolerance of +/-0.005 (a couple of isolat
Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Thu Mar 24 07:06:06 EST 2005 | davef
There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows
Electronics Forum | Fri Apr 06 10:43:57 EDT 2007 | flipit
Hi, Anyone seeing difficulty is soldering MLFs or QFN with lead free solder? I have an MLF with 3 rows of pads on each of the 4 sides of the part and then the large center ground plane in the middle. The part is 20 mil pitch. Had good luck with l
