Electronics Forum | Thu May 29 10:42:40 EDT 2003 | swagner
So is it fair to say that on a moisture laden double sided flex circuit you could see an increase in tombstoning on the 2nd pass due to warpage created by delamination? In other words a 0603 for instance could tombstone due to the delaminated surfac
Electronics Forum | Wed Dec 20 11:21:50 EST 2006 | SWAG
We ended up switching PCB suppliers and PCB material altogether. We built 400+ units with the new material and got zero delamination. It's still unclear what the real solution is as we introduced two changes at once. This new supplier is going to
Electronics Forum | Mon Apr 02 18:31:13 EDT 2007 | SWAG
I hate to drag this one out again but we are done with this. We tried an oven profile on the bare panels that was quite different from our original. This profile was recommended by the mfg. of the laminate. We experienced random delamination. Som
Electronics Forum | Sat Nov 11 22:43:50 EST 2006 | KEN
Hey Sr. Tech. Before you get crazy with changing the process or chemistry I would first verify you are using the correct mix ratio. A refractometer can be a useful tool in these cases. I have seen this in the past where the maintenance technician
Electronics Forum | Mon Nov 13 09:22:10 EST 2006 | aj
Hi all, Should we need to order the Higher TG to run boards safely thru a RoHS Process (reflow only)? We had an issue with the previous batch delaminating and were advised by supplier that we should have stated the higher TG rating even though the p
Electronics Forum | Wed Aug 01 18:14:13 EDT 2007 | swag
We had the same trouble. We baked our boards out but the delamination continued very random. One board would be fine and the next was a nasty explosion of delam. Switched material - no problems since. I never found out the technical reason behind
Electronics Forum | Thu Nov 20 13:00:36 EST 2008 | jameskelch
Calling out materials by name locks you into laminates by brand. If these are typically phenolic materials it can lead to moisture absorption, less mechanical strength and more prone to delamination during assembly. It is more effective to refer
Electronics Forum | Mon Dec 08 11:46:09 EST 2008 | mleber
We are experiencing delamination / measling on card we have been running for years. No change in process. Same equipment, profiles etc. The weird thing is we are experiencing it on pwbs from different mfgs and different processes (reflow, wave, selec
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
Electronics Forum | Mon May 14 22:24:11 EDT 2001 | davef
The time over liquidous of the profile seems short. But then again, who knows? Based on what you told us, I'm guessing at a board fabrication problem, either measling or delamination. Probably the former, rather than the latter. [Now, we remember
