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Parts & Supplies | Pick and Place/Feeders
JUKI MTC PX500060000 VACUUM PAD Other juki parts: PX060010000 AUTO SWITCH PX060013000 AUTO SWITCH PX060029000 AUTO SWITCH PX068502000 AUTO SWITCH PX500014000 PLUG PX5000500A0 BRACKET PX500051000 VACUUM PAD 4 PX500052000 VACUUM PAD 8 PX50005
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Parts & Supplies | Pick and Place/Feeders
CP7 JAW Claw DCPL0190 Mounter Parts FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00 Nozzle 3.7 AA0HR01 Nozzle 5.0 AA08000 Nozzle 7.0 AA08100 Nozz
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Parts & Supplies | Pick and Place/Feeders
2AGGGA000700 XPF camera glass (front glass) FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00 Nozzle 3.7 AA0HR01 Nozzle 5.0 AA08000 Nozzle 7.0 AA08
Parts & Supplies | Pick and Place/Feeders
Brand Part Name Model Condition Description FUJI Nozzle AA07000 Original New with stocks Usage For FUJI Machine More relative parts : Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA0680
00365776-01 Limit Switch Width Adjustment 2 00365777-01 Limit Switch Mounting Tub 00366104-01 TR-GREASE NIPPLE 00366174-01 CARTOUCHE FOR GREASE 00366229-01 RETROFIT KIT CAL.. f. S25HM2/HS55/HF 00366391-01 STOPPER PCB ADJUSTMENT 00366392-01 Sto
M001 LG0-M7701-00X I-PULSE M1 SERIES PK NZ -M001 (0.5 X 0.4)** M002 LG0-M7703-00X I-PULSE M1 SERIES PK NZ -M002 (0.9 X 0.62) M003 LG0-M7705-00X I-PULSE M1 SERIES PK NZ -M003 (1.3 X 0.7) M004 LG0-M7707-00X I-PULSE M1 SERIES PK NZ
Parts & Supplies | SMT Equipment
ROLLER PULLEY 101130202503 for FUJI FUJI H1193W PAD VP6RSE FUJI H1193X PAD VP10LBNE FUJI H1193Y PAD VP15LBNE FUJI H1194A TO H1193A FUJI H1194B PAD KP-3.5-N-31W FUJI H1194C PAD KP-6-N-31W FUJI H1194D PAD VACUUM KP-10-N-31W FUJI H1194G PAD VAC
Technical Library | 2019-05-21 17:34:08.0
Flip chip components have been gaining popularity in the electronics industry since their introduction in the 1960s. Advances in attach methods and adhesives, as well as the drive for smaller and faster electronic devices made the technology take off. The basic premise of the flip chip is that the chip (semiconductor device) is mounted flipped from the traditional position. The traditional method of mounting a die is to mount it on a lead frame with the circuit and bond pads face up. The bond pads then receive a bond wire which then connects to the proper lead on the lead frame. Flip chips are mounted face down onto a substrate using small bumps on the bond pads to make direct electrical connection to their respective pads on the substrate. Stay tuned for more information on attachment techniques next month. This article will focus on how to rework flip chips.
Parts & Supplies | SMT Equipment
KE730——760 PART No. PART NAME SIZE(mm) REMARKS E3501-721-0A0 #101 ASS'Y φ1.0/φ0.4 E3502-721-0A0 #102 ASS'Y φ1.5/φ1.0 E3503-721-0A0 #103 ASS'Y φ3.0/φ1.7 E3504-721-0A0 #104 ASS'Y φ4.0/φ3.2 PAD TYPE E3505-721-0A0 #105 ASS'Y φ6.5/φ5.0 PAD TYPE E35
Parts & Supplies | SMT Equipment
JUKI 501 NOZZLE E3600-729-0A0 40001339 KE730——760 PART No. PART NAME SIZE(mm) REMARKS E3501-721-0A0 #101 ASS'Y φ1.0/φ0.4 E3502-721-0A0 #102 ASS'Y φ1.5/φ1.0 E3503-721-0A0 #103 ASS'Y φ3.0/φ1.7 E3504-721-0A0 #104 ASS'Y φ4.0/φ3.2 PAD TYPE E350
