Electronics Forum | Thu Jun 24 09:24:03 EDT 2004 | Rob
The smallest component we use is 0402. Solder paste is Kester 256. Printer is MPM Ultraprint 2000. Stencil is 6 mil. I didn't here anything bad (rework or whatnots) in terms of soldering of those components.
Electronics Forum | Mon Dec 30 16:08:08 EST 2013 | emeto
I would also check the stencil thickness. You don't want 7mil stencil for 0402 components.
Electronics Forum | Wed Sep 20 09:37:15 EDT 2000 | Erick Russell
Determining cost of rework is based on usage and application. Photonic soldering saves an average of 5 minutes per rework site in process time and may save a significant amount of labor. Depending on volume, and specifics on the application, the cos
Electronics Forum | Wed Feb 12 10:03:47 EST 2003 | stefwitt
Greg, you pointed out yourself the many advantages of bulk feeding. I would like to mention that the higher component accuracy and the feeding track accuracy of the bulk feeder contribute to an improved pick failure rate of small ( 0402�s ) component
Electronics Forum | Tue Jul 18 16:14:45 EDT 2023 | daniel_stanphill
I remember having seen an ad on LinkedIn or somewhere that showed a handheld pen capable of manual deposits even on 0402 and 0.4mm fine pitch pads. I have been trying to search for it today and am seeing some comparable products but nothing that look
Electronics Forum | Thu May 03 16:01:06 EDT 2007 | geb
Hi, We are in the market for some Inspection Equipment. We have never bought any before but have trialed two types so far. A Mantis system, and a camera system with built in microscope. We are keen on getting the camera with scope so that we can use
Electronics Forum | Tue Aug 11 17:36:44 EDT 2009 | dyoungquist
You are looking for a complete SMT assembly line plus possible X-Ray inspection and rework equipment. The 3 components of the SMT line are stencil printer, pick-n-place machine and reflow oven. How small are your components? 0603? 0402? What is the
Electronics Forum | Mon Dec 15 15:34:17 EST 2008 | dyoungquist
Sorry it has taken me so long to respond. I got pulled off onto other projects and was not able to work on the solution to the problen until recently. The solution we have come up with is to change from no-clean flux based solder paste to water sol
Electronics Forum | Wed Jul 11 06:14:21 EDT 2018 | uzbek
Hello, we are currently designing one device that needs shielding. Under the shield, there is one BGA chip and 0402 components. Now we have a dilemma whether we should go for a one-part shield or two-part shield. We talked with several EMS companie
Electronics Forum | Mon Oct 09 07:50:22 EDT 2006 | quad
We currently run two Quad IVC's (we are very pleased with them) and two Versatronics for simple small volume batch work. We now need an additional machine capable of placing components at least three times as quickly as a IVC. We don't do anything ve
