Electronics Forum | Fri Mar 19 13:26:19 EST 1999 | Scott Cook
| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet
Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Fri Aug 17 08:37:47 EDT 2001 | jbieber
Gregory, I think that the profile is too radical, i.e. zone 6 to zone 7 temperatures are too far apart. I would guess that the solderjoints have not all reached 183C in zone 6 which is why the uBGA's do not have a symmetrical ball collapse. You may
Electronics Forum | Tue May 23 17:49:07 EDT 2006 | flipit
Hi, Ok I have some numbers for you on my process. For the last 2 years we have been placing 4 BGA on a 2" X 5" X 0.062" PCB. The BGAs are 16X16 256 ball, 15X11 165 ball, 8X8 64 ball, and 26X26 456 ball. The 8X8 is 0.8mm pitch and the others are 1
Electronics Forum | Sun Aug 23 11:30:51 EDT 2009 | ysutariya
I think you're getting steered in the wrong direction, with the exception of DaveF's link. By the way, I'm a PCB fabricator, just to avoid any backlash. IPC 4101 is the IPC guideline for raw materials. It has 6 slash sheets for lead-free capable
Electronics Forum | Thu Jul 29 11:14:46 EDT 1999 | Justin Medernach
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Tue Jul 27 16:44:31 EDT 1999 | Earl Moon
| | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | 12BGA per assembly | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | Pads .014inch | | | Vias within footprint .020inch | | | Vias to be filled by bottom side(sol
Electronics Forum | Tue Jul 27 17:23:45 EDT 1999 | M.L
| | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | 12BGA per assembly | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | Pads .014inch | | | | Vias within footprint .020inch | | | | Vias to be filled by b
Electronics Forum | Wed Nov 25 17:21:17 EST 1998 | Michael Allen
A word of caution: thick webs (i.e., shallow score grooves) can result in scrapped boards, especially if you've got the dual-wheel-type score breaking machine. I discovered recently that shallow score grooves, combined with DULL knife-edge guides on
Electronics Forum | Fri Jun 26 11:27:12 EDT 1998 | Earl Moon
| | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Han
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