Electronics Forum: 0805 and problem (Page 10 of 79)

Inspection and splicing

Electronics Forum | Tue Aug 21 08:34:03 EDT 2007 | rgduval

We have the same problems with cut/tape parts. But, we specialize in short-run prototypes, so I don't have much of a choice but to deal with it, and find a way to make it as easy as possible. We just demo'd a splice tool from Sierra Electronics (ww

Re: MoonMan and Tetras

Electronics Forum | Tue Apr 27 05:26:14 EDT 1999 | Charles Stringer

| | Hey MoonMan, | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop!

Re: MoonMan and Tetras

Electronics Forum | Tue Apr 27 09:26:43 EDT 1999 | Chrys Shea

| | | Hey MoonMan, | | | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | | | We we're all set up to go to Tetras, then mgt decided to close down our factor

Re: Voids and BGA

Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon

| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I

Pick and place labels

Electronics Forum | Fri Sep 24 12:02:57 EDT 2004 | Frank

Yes, I can see your problem, the nozzle makes only good contact in the center and so the ends don't make good contact. The ends tend to curl up during reflow. There were two suggestions to solve this. 1) Let the operator push down the labels befor

Touch-up and Inspection Process

Electronics Forum | Thu Mar 03 09:04:26 EST 2005 | russ

Been following this thread and have a question, Why do "touch-up" people follow different criteria than "Q.C." people. It sounds like the root of the problem is not addressed but bandaids are being put into place. We have no "Q.C." department and

Inspection and splicing

Electronics Forum | Thu Dec 21 13:11:25 EST 2006 | SWAG

We have fought with cut-tape way too much. It's always a bad idea. We've tried a couple methods/devices for manual splice with limited success. Before you look into this I would ask them if they could supply you cut tape qty's inslusive of fairly

QFN's and LGA's

Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis

QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in

IP1 and SSOP28

Electronics Forum | Tue May 18 16:40:22 EDT 2010 | m79d

I am having some problems getting the IP1 to place a SSOP28 package,pitch 0.65mm lead width 0.3mm. I am selecting computer vision 012 (tried 011) and vision type 100. EL data was put in looking at the datasheet and also measuring the device. Have tri

Manncorp Pick and Place

Electronics Forum | Tue Aug 05 21:08:10 EDT 2014 | isd_jwendell

You are correct about the Manncorp machine, it was an MDC machine. The Essemtec machine is old(ish) but still runs fine, and last I knew they were still supporting it. My recent problem with Essemtec was in regards to software. I found a bug and sim


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