Electronics Forum | Wed Nov 05 08:24:16 EST 2003 | Paul O ' Connor
When reflowing a Vishay PowerPak SO-8 & using the recommended footprint from the data sheet, the component is skewing in reflow, to solve this we have to add a glue dot to both sides of the part, will making the PCB land pad 1:1 with the Solderable
Electronics Forum | Sun Sep 12 21:31:49 EDT 2004 | Jim
MAke a new stencile and have the aperatures reduced by 20% in X and Y. This has solved 90% of all solder balling issues I have ever dealt with. Be careful with your fine pitch and micro-BGA's. If you are not having problems with fine pitch and 1:1
Electronics Forum | Fri Jun 10 09:02:58 EDT 2005 | ktron
Hi Guys.. Does anybody had experienced with designing the stencil for Right Angle LED without any dewetting problem on the LED termination? Currently our stencil opening is 1:1 and we still got so high reject due to this problem. Pls Advise, thanks
Electronics Forum | Tue Sep 26 08:42:49 EDT 2006 | aj
me and my big mouth. we are currently running a leadfree product and I am getting MCSB on all 1210 caps. Using homeplate with 10% reduction 6thou stencil. I contacted my stencil supplier to ask for advice- they are looking into it but he did menti
Electronics Forum | Mon Oct 02 20:10:27 EDT 2006 | davef
Choices are: * Buying a helmet. * Using a paste with low residue flux. Where are you located that you can use Triklone N [1,1,2-trichloroethene, CAS No: 79-01-6, C2HCl3]? As a solvent replacement for Triklone, several companies offer proprietary bl
Electronics Forum | Tue Apr 24 02:56:12 EDT 2007 | chrispy1963
If the PCB you are using is a HASL pad finish and is a leaded assembly, we use homeplate pads with a 5 mil stencil. If the circuit has Enig finish and is PB-Free then we use 1:1 apertures with a 5 mil stencil Either method should provide no solde
Electronics Forum | Wed Jun 20 08:14:36 EDT 2007 | pavel_murtishev
Good afternoon, You should use overprint technique if you have any problems with paste volume (PIH technology and mixed designs, for instance). Otherwise, it is useless. Overprint has to be made in such way so that paste would have an ability to flo
Electronics Forum | Tue Mar 04 11:28:46 EST 2008 | clampron
Good Morning, I have an application that we are tooling up for that has several LGA (Land Grid Array) components. The Gerber files from the customer has a solder paste definition of 1:1 to the pad. As I look at this part, I cannot believe that this
Electronics Forum | Thu May 29 14:35:37 EDT 2008 | rdmundo
Gents, We've been using a round 1:1 aperture for a 5 mils thickness on our stencil design on 0402 and recently, IPC guidelines recommend oblong, homeplate or reverse homeplate. I believed the PCB pad for 0402's area within the recommended size/dimen
Electronics Forum | Thu May 29 17:19:51 EDT 2008 | dyoungquist
On 0402s we use 20x25 mil pads with a 15 mil gap between the pads on the pcb with ENIG finish, 5 mil stencil with a 1:1 aperture (20x25 mil) and SAC305 lead free solder paste. We very rarely see any tombstoning on 0402s using this setup.
