Electronics Forum: 2

Wave Solder Immersion Depth, Contact length, Dwell Time etc.

Electronics Forum | Thu Feb 15 23:52:31 EST 2001 | Dreamsniper

Hey guys, I ran a couple of profile in our wave solder machine using wave optimizer and this is what i got: Parallelism = 0.0 Immersion Depth = 2.1mm to 2.4mm with varying immersion time from 1.1 sec to 3.1 secs. Contact Length = between 5.0 to 6.0

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

Spray Fluxing

Electronics Forum | Thu Jan 18 04:30:52 EST 2001 | johnwatt

Ok so for me, spray fluxing is the way to go every time....for one you don't need to worry about colapsing your foam with pallet's that are hot or worrying about your pummace, your thinners, SG and so forth...man life in foam fluxer land was hard. N

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef

We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which

SMT machine Utilization

Electronics Forum | Wed Aug 01 01:54:57 EDT 2001 | djarvis

Bayanbaru, We do ours like this. We don't care per se about machine utilization. The actuaries have figured out that the facility costs $X per minute to run, this includes wages, utilities, consumables, machine payments, depreciation and whatever els

Re: Package tilting during assemly

Electronics Forum | Tue Oct 20 11:37:38 EDT 1998 | Stefan Witte

All SM machines pick components with a vacuum nozzle. Most likely the component is picked in the geometric center, which may not be the center of gravity ( SOT 23, SO 89 ). Any other pick position than the center may be taught upon requirement, but y

Vacuum Bags

Electronics Forum | Wed May 16 13:06:33 EDT 2007 | stepheniii

3.3.2.1 Moisture Barrier Bag (MBB) The moisture barrier bag shall meet MIL-PRF-81705, TYPE I requirements for flexibility, ESD protection, mechanical strength, and puncture resistance. The bags shall be heat sealable. The Water Vapor Transmission Rat

Re: Discoloring of Soldermask and silkscreen

Electronics Forum | Tue Apr 13 18:39:24 EDT 1999 | Tom B

| | Netters, | | | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | | | 1. Kester 293 no clean | | 2. 2.1 C/s for 30s to 150 C | | 3. .5 - .7 C/s f

Re: Discoloring of Soldermask and silkscreen

Electronics Forum | Tue Apr 13 23:08:56 EDT 1999 | Jeff Sanchez

| | | Netters, | | | | | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | | | | | 1. Kester 293 no clean | | | 2. 2.1 C/s for 30s to 150 C | | | 3.

Re: Discoloring of Soldermask and silkscreen

Electronics Forum | Wed Apr 21 00:35:31 EDT 1999 | Scott Cook

| Netters, | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | 1. Kester 293 no clean | 2. 2.1 C/s for 30s to 150 C | 3. .5 - .7 C/s for 60s to 185


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