Electronics Forum: 2011 (Page 10 of 216)

Tin Plated Components

Electronics Forum | Fri Mar 18 16:25:07 EDT 2011 | bradbriggs

Thanks I will check it out.

Insulator against Solder pins

Electronics Forum | Sat Mar 19 09:46:55 EDT 2011 | davef

Try 'fish paper' it's a vulcanized fiber sheet

BGA failure when chamber test

Electronics Forum | Mon Mar 21 12:34:58 EDT 2011 | scottp

If there was a ball in cup defect on the original assembly then it could behave like you explained.

BGA failure when chamber test

Electronics Forum | Mon Mar 21 23:10:13 EDT 2011 | kemasta

Hi Scott Thank you very much.

Stencil Washer Waste Disposal

Electronics Forum | Mon Apr 04 11:59:59 EDT 2011 | aj

Hi, Can you let me know the make of the evaporator you use? Thanks, Alan...

Heller 1707EXL chain oil jar

Electronics Forum | Tue Mar 22 14:05:33 EDT 2011 | glenseely

Have you tried to contact Heller?

IPC/JEDEC standard for solder paste printing defects

Electronics Forum | Fri Mar 25 14:33:26 EDT 2011 | davef

IPC-7525 Stencil Design Guidelines

Dealing with BGA solder ball in via hole

Electronics Forum | Thu Mar 24 16:53:53 EDT 2011 | davef

Can you jumper the via to the pad?

X-Ray Inspection

Electronics Forum | Mon Mar 28 07:49:42 EDT 2011 | davef

just after part placement * Sloppy printing => just after printing

what's IPC9850 and MNVC?

Electronics Forum | Tue Mar 29 20:59:55 EDT 2011 | lisalau

Recieved,thanks!


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