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New Equipment | Industrial Automation
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New Equipment | Industrial Automation
Contact: Nancy Lin Email:info@amikon.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Control Systems (DCS, PLC/SPS, CNC) - Panel Controllers - HMI and Display Panels - Industrial PC’s - Drives
S & B CONTROLS 38111500500000 TEMP.CONTROLLER S & B CONTROLS 38111501401110 TEMP.CONTROLLER S & B CONTROLS PRCQ1-00-1000 TEMP.CONTROLLER S & B CONTROLS RCQ4-00-2222-08 DIGITEMP MC S & B CONTROLS RCQ4-21-2222-08 DIGITEMP MC S & B C
Electronics Forum | Tue Nov 14 03:00:14 EST 2000 | sarry
I have one suggestion why don't you align all parts and take a close look at it if you can find any misaligned component after that. IF SO, that's machine's repeatibility problem.(or mechenical problem-dirty nozzle, wrong pick up and placement height
Electronics Forum | Sat Aug 14 17:39:37 EDT 1999 | Gerry S.
One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with the
Electronics Forum | Thu Apr 07 11:39:48 EDT 2011 | remullis
My oven profile is 155,160,165,180,220,245,255,227 Cooling Zone 132/92. This is a 8 zone CV820 Technical Devices oven. My assy profile using Datapaq Q18 - Base on one probe feedback - Positive slope (7.09), Pos Slope Time (.45), Rise Time (1.17), Me
Electronics Forum | Sun Aug 15 14:56:03 EDT 1999 | Dean
| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th
Electronics Forum | Mon Aug 16 04:34:54 EDT 1999 | Earl Moon
| | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with
Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer
| | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit
Electronics Forum | Mon Aug 16 16:54:57 EDT 1999 | Scott Cook
| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th
