Electronics Forum: 2mm (Page 10 of 25)

Having issues placing 0603 components on my used Juki 740...

Electronics Forum | Mon Jul 11 13:21:40 EDT 2016 | bradholland

well there you go. I found that trying different values in the "Placing Stroke" had a big effect. I changed it to 2mm and it placed them well, but I could see the board also flexing a little, went to 1mm and the problem came back, so have sat in th

Assembleon Eclipse II Calibration problem Z

Electronics Forum | Thu Sep 15 16:40:55 EDT 2016 | zippi

Hello, i have a problem with the Calibaration of my Assembleon Eclipse II. There is a problem with the down Z Position of Head 2. They are 2mm deeper as Head1 by picking up any Componend. Laser High are OK. How Can i setup the Head down High.

The minimal distance btw component and the edge of pcb

Electronics Forum | Sat Nov 05 20:23:11 EDT 2016 | sarason

Close but not to close, would have to be the spec. Or depends on your separating technology. Prerouted boards on a panel, you could go right up to the edge. V-grove you will need more distance, maybe 2mm's or more. The distance from the panel edge to

Temperature Profile for 0.2mm Thick ENIG Flex PCB

Electronics Forum | Fri Jan 31 10:04:14 EST 2020 | emeto

Jinesh, My initial suggestion is you have too much solder past. Please try to reflow a few of these parts without solder paste. Colse aperture, put some tacky flux on this part location and give it a try. I bet you will not see any voiding.

PCB Thickness and BLR

Electronics Forum | Mon Jun 03 13:26:32 EDT 2019 | az2019

Hi, I have a general question about the relationship of PCB thickness and BLR testing result. For example, I have QFN6x6 parts mounted on board in 1.2mm, 1.6mm, and 2.4mm thickness. All boards have 6 layers of Cu. Studies show thicker board gives les

super fine pitch paste & dispensing questions

Electronics Forum | Mon Aug 16 13:38:35 EDT 2010 | rl

i would like to request some advice on manually dispensing paste for super fine pitch components. first some background. i am a small design house and specialize in sub-miniature prototypes for avionics. so far, i have mostly used stainless steel st

Pin-in-Paste, Intrusive Reflow, Solder Preforms, etc.

Electronics Forum | Fri Dec 15 03:16:11 EST 2006 | pavel_murtishev

Good morning, The critical points for successful PIP technology are: 1. Gap between THT lead and PHT hole. It shouldn�t be greater that 0.2mm; 2. Lead shape. THT leads MUST be straight or you�ll get excessive voiding otherwise; 3. As Russ said, pas

MELF component short togehter

Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew

Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component

Replacing small SMD PMICs

Electronics Forum | Sun Feb 10 16:35:06 EST 2008 | neocera

Hi, I have a PCB with a blown PMIC (power management integrated circuit) multi voltage regulator IC. The PCB is rather rare and I need to replace the PMIC, its footprint is 7mm X 7mm with 12 solder points per side. Unfortunately I can only solder th

how to solder manganin 0.05mm manganin wire to a copper plate

Electronics Forum | Fri Jan 30 00:41:04 EST 2015 | neeraj_iiser

Thanks a lot , my application is cryogenic in nature. I am trying to make a Sub-Angstrom resolution Thermal expansion sensor, whose components have been machined out of OHFC copper, and i needed to solder a manganin wire to one of the capcitor plates


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