New Equipment | Soldering Robots
C-Turn Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up to 160 x 160 mm. The Nordson DIMA Desktop Series is a p
New Equipment | Assembly Services
TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left
Industry News | 2007-11-27 12:13:09.0
FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.
New Equipment | Soldering Robots
C-Prime Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm. The Nordson DIMA Desktop Series is a product range for ACF
Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis
Toddco3 Hotbar Bonding or Soldering System is a modular, floor standing bonder with a precision servo-driven rotary table. Compact overhead controls system with touch-screen display for easy operator acess is standard. Standard system software provid
Used SMT Equipment | Semiconductor & Solar
Standard Machine features and system description: Ultra-fine pitch and small ball bonding capabilities High frequency transducer operating at 138 kHz Applicable wire size of 0.6mil-2.0mil High speed XY table with linear motor technology High ac
QuadTech manufactures a complete line of AC/DC Hipot, Insulation Resistance, Ground Bond, and Leakage Current Testers for production and compliance testing on a wide range of electrical products and appliances. QuadTech manufactures proudly a Famil
Spare parts for Wire Bonding (Ball Bonding) machine
The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
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