Electronics Forum: adding solder to bga (Page 10 of 21)

Soldering Lead-Free Globtop BGA to Pin-Socket Interposer

Electronics Forum | Tue Nov 18 15:03:39 EST 2003 | Mark

Yup. I'm attempting a small, but very important experiment. I need to solder several Lead-Free Globtop BGA parts to a Pin-Socket interposer assembly. I'm trying to come up with the best way to do this. I'm thinking of using lead-free solder paste, (b

Soldering Lead-Free Globtop BGA to Pin-Socket Interposer

Electronics Forum | Fri Nov 21 14:15:09 EST 2003 | russ

If you use regular solder paste you will not need to process at the higher temp. Using Flux only will require you to reflow the lead free balls. When we process ceramic BGAs with the high temp/lead free balls we always use 63/37 paste and it works

Voiding in board to BGA joints

Electronics Forum | Sat Mar 06 06:15:14 EST 2004 | Bryan

Thanks Tommy. In fact I've tried many types of profile,but it didn't work.I'll try to make the peak temp. as low as 205C and dwell long as in some threads Dave said.I've tried baking the BGA and PCB before mounting also dindn't work.yes,I've heard th

Micro BGA pads, adhesion to laminate

Electronics Forum | Wed Jul 09 04:57:11 EDT 2003 | Matt Kehoe

Our company applies solid solder to surface mount lands. While processing a micro BGA design we had some pads fall off, peel, whatever you might call it, from the surface of the board when touched "GENTLY" with the tip of a blade to remove a small s

Re: Time to use alternative finishing ???

Electronics Forum | Mon Sep 13 05:02:19 EDT 1999 | Brian

| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with

Cleaning BGA pads prior to rework

Electronics Forum | Fri Apr 09 07:47:51 EDT 2010 | jdengler

Hi John, Our ERSA rework station came with a soldering iron that has a few special tips. We normally do not have a stencil and use tacky flux, so I use the concave tip to prep the pads. This leaves solder on the pads but with a little practice you

Why does everyone want to x-ray BGA?

Electronics Forum | Thu Apr 16 21:33:25 EDT 1998 | Steve Gregory

Hello Ya'll, I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? I know what most people will tell me; "Steve, that's a pretty silly question

Why does everyone want to x-ray BGA?

Electronics Forum | Thu Apr 16 21:30:59 EDT 1998 | Steve Gregory

Hello Ya'll, I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? I know what most people will tell me; "Steve, that's a pretty silly question

Lead manufacturing to lead free transisition

Electronics Forum | Thu Mar 01 21:20:47 EST 2007 | J.R.

Let's talk pin holes and blow holes. I've been here since the transistion of leaded to lead-free process started for our company and we purchased a wave machine just to keep up with our lead-free orders. we put out 500-1000 boards a day both leaded a

uBGA 380 Solder ball to pad

Electronics Forum | Thu Jun 19 21:39:31 EDT 2008 | mika

Hi, we used to have a RoHS package with uBGA 380 Solder ball's 0.8 mm pitch approx 15x15 mm, bump size is 0.4mm on a 0.33mm pad. Suddenly we need to use another vendor for various reasons. However, the new bump size is 0.45mm according to specs and t


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