Electronics Forum: adhesives (Page 10 of 144)

Re: Curing of Glue for SMT Components

Electronics Forum | Sat Jun 17 09:09:15 EDT 2000 | Chrys Shea

Contact the adhesive manufacturer, or their website. Most adhesive suppliers offer two cure options - one with a belt oven profile and one with a box oven profile. The belt oven is usually a ramp and plateau of 120-150C for approx 2 minutes. The b

Re: stencil epoxy debonding

Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber

There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det

Re: Stenil printing adhesive

Electronics Forum | Wed Oct 14 10:04:02 EDT 1998 | Dr. Kantesh Doss, Siemens Energy & Automation, Inc.

Sanjay: Keys to successful adhesive printing are: 1. Understanding the flow behavior of the adhesive under constant shear stress 2. Stencil design, i.e. stencil aperture opening 3. PWB Footprint 4. Stencil printing parameters Optimizing all these fac

Screen Printing Adhesive on Mixed Technology Boards

Electronics Forum | Mon Nov 26 15:30:35 EST 2001 | jhingtgen

To all, For the benefit of everyone there will be a session conducted at APEX on this topic. I have included the information that I pasted from the APEX website (http://www.goapex.org). ADHESIVE PRINTING Chris Marinelli, Loctite Tuesday, Janua

Adhesive printing

Electronics Forum | Fri Feb 01 10:19:22 EST 2002 | cyber_wolf

Whoa! I beg to differ my friend. The cure profile is VERY critical in Adhesive curing, especially if your are screen printing. When you screen print adhesive you are leaving it exposed to the atmosphere for a period of time. SMT adhesive by nature i

Re: Cure/Reflow Profile

Electronics Forum | Wed Feb 23 09:08:55 EST 2000 | Sal

Hey Guys, Thanks for the input and suggestions. Just been onto the adhesive manufacturer who reckons they should be no issue using a reflow profile for curing his adhesive , as long as the profile duration is not 6 minutes or over, which would bake

2-sided Process

Electronics Forum | Mon Jul 10 15:13:56 EDT 2000 | Mark Charlton

I know it's been brought up a thousand times before but after an hour of searching the archives I'm taking a short-cut. When processing one side of a double-sided assembly with adhesive, should the adhesive side be processed first or should "side" c

Re: Cure/Reflow Profile

Electronics Forum | Wed Feb 23 09:08:55 EST 2000 | Sal

Hey Guys, Thanks for the input and suggestions. Just been onto the adhesive manufacturer who reckons they should be no issue using a reflow profile for curing his adhesive , as long as the profile duration is not 6 minutes or over, which would bake

Adhesive Application by Stencil

Electronics Forum | Thu Mar 22 16:19:40 EST 2001 | rwilliams

In regards to SMT adhesive application by stencil: Can anyone make any recommendations for: SMT Adhesive Material itself? Squeegee Blade Material? Stencil Material? Characteristics/Features of your Stencil? E.g., thickness, aperture ratios, etc... P

Re: Adhesive

Electronics Forum | Tue Jul 27 10:11:26 EDT 1999 | John Thorup

| Does anyone know where I can find the supplier of an adhesive RTV5204. | Don't know for sure but General Electric silicone rubber adhesives are prefixed with "RTV" Try GE silicones at 518/233-3330 (might be an old area code) or distributor R.S. H


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