Electronics Forum | Wed Jan 26 21:30:06 EST 2000 | Dave F
Tuan: Consider Sn 96.5/Ag 3.5 or Sn10/PB88/Ag02 also. As Glenn says, you had better get rid of that gold or you will never have a shiney connection. Not that a shiney connection means anything about the quality or reliability of your soldering. M
Electronics Forum | Mon Oct 25 15:56:56 EDT 1999 | Dave F
William: Three things: 1 If the gold is porous, it will not protect the nickel and the nichel wiil oxidize and become unsolderable. 2 If the nickel is not solderable, the gold overcoat will not improve that. 3 Ag or Au over electroless Ni creates b
Electronics Forum | Mon Nov 19 10:06:15 EST 2001 | davef
Git otta taun!!! I never have heard of an Sn62 BGA solder ball. Several thoughts on Sn62: * Look at http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4603&#Message17953& * Search the fine SMTnet Archives on � Sn62 �
Electronics Forum | Wed May 07 09:02:17 EDT 2003 | Kris
Hi SnAg is a binary alloy and does not have the same effect as a ternary SnAgCu alloy as far the pasty range is concerned. But then paste only can do so much. The best way to do it is to have proper pad design, controlled placement and reflow. I w
Electronics Forum | Mon May 12 23:28:33 EDT 2003 | dehlers
To the best of my knowledge and experience the 2 % Ag component is not for embrittlement but rather to reduce gold scavenging caused by the propensity for tin to react with the gold. I have seen eutectic tin/lead actually disolve gold wire after a f
Electronics Forum | Tue Aug 30 09:24:08 EDT 2005 | Slaine
we manufacture a range of ceramic parts that have silver termination,there is already a small leaching problem (absorption of the termination by the solder in liquid form)with Sn62 that we live with, having to implement unleaded solder they are norma
Electronics Forum | Tue Aug 30 12:49:59 EDT 2005 | Ted
Slaine, We use a Pd/Ag thickfilm paste. Because of the leaching we had to start using solder pastes that have silver in it. For RoHS, we are using a solder paste with an alloy of Sn95/Ag05. We also have to double print the thickfilm pastes. I h
Electronics Forum | Thu Jun 29 04:07:25 EDT 2006 | slaine
Hi I manufacture a range of components with Ag,Pd,Pt terminatons. Has the solder wetted to the componet and is the termination still left on the component? I would expect the solder to remain on the pad though, if all your other devices on the pcb ar
Electronics Forum | Fri Jul 07 02:20:03 EDT 2006 | AR
Hi Yes, this is the only component with Ag/Pd finish. I found that by applying a copious amount of solder on the pad (we are using a dispenser) the component will be soldered. Although most of the solder coalesces on the terminations of the componen
Electronics Forum | Mon Nov 20 21:55:21 EST 2006 | brodalvin
Does SnPbAg solder paste have a reliability risk if subjected 2 times in reflow oven at 230�C? I want to implement my project immediately. If samples will be subjected to our reliability it would take three months before I can implement my project.
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