Electronics Forum | Mon Oct 19 13:32:06 EDT 1998 | Mark Schwarz
| How are solder pastes manufactured right from the level of extracting lead and tin ? | | | The Tin Institute is good but I rarely find that the raw metals industries guys know about pastes. Making a tin-lead alloy for pastes, as for raw bars, is
Electronics Forum | Thu Apr 29 17:38:47 EDT 1999 | JohnW
Ok folk's has anyone used Alpha Metal's UP78 solder paste ? Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. My question's are really : how is the printability of the pas
Electronics Forum | Mon Jun 28 14:36:34 EDT 1999 | John Thorup
| | I am looking for a way to clean solder off of QFP packages. I'm thinking a chemical method would be easy, as long as the chemistry doesn't attack the leads themselves, or the package. | | Any suggestions? | | | Dear Matt, | | I have a customer
Electronics Forum | Tue Apr 29 15:45:09 EDT 2003 | davef
We have mixed bar solder from alternate suppliers in our wave soldering machine. Issues that you need to address before changing your solder supplier are: * Assure that the alloys are the same. In this, consider imaginative people may be reporting
Electronics Forum | Mon Dec 17 19:18:53 EST 2007 | bbarton
OH MY GOD!! Finally it's becoming public knowledge here on the streets. YES germanium is in this material. As much as these guys and ALPHA METALS wanted to keep these things secret, anyone with a halfway competent lab would quicky find out why all of
Electronics Forum | Tue Sep 21 12:10:23 EDT 1999 | Mario
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Sun Jun 27 06:27:15 EDT 1999 | Vic Lau
| I am looking for a way to clean solder off of QFP packages. I'm thinking a chemical method would be easy, as long as the chemistry doesn't attack the leads themselves, or the package. | Any suggestions? | Dear Matt, I have a customer, who is com
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Sat Jan 06 22:09:53 EST 2001 | Greenman
Cory, I've got a lot of experience of testing of this type. The physical (not chemical) nature of the flux residues is the crucial issue in compatibility. If you have a softer residue (either caused by a thick initial solder paste deposit, or a low p
Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary
The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate
