Electronics Forum | Mon Apr 05 13:23:07 EDT 2004 | Ron W
Low-consumption Nitrogen configurations with an on-board O2 analyzer is the ideal way to go. I cannot speak for all oven manufacturers, but ours have N2 fed to the reflow zone only, which to me is really only where you need it. The gauges/flowmeters
Electronics Forum | Mon Aug 16 20:22:54 EDT 2004 | Grant
Hi, Thanks for the info! In the software can you add solder paste specs and heat sensitive components and see where the profile sits against these fast? Measurement is the easiest part I think, but what I thinks harder is good software to analyze th
Electronics Forum | Tue Feb 01 09:53:37 EST 2005 | Howard Sommerfeld
I also have a spreadsheet tool for comparative analysis using criterion weighted scoring. It can be used to analyze any decision, and helps groups reach consensus on why a particular alternative is the way to go. As final steps you can also consider
Electronics Forum | Tue Apr 05 09:10:12 EDT 2005 | Dave G
You may have to get him to see a dermatologist or allergy specialist. Also, analyze exactly what he's coming in contact with during the course of a workday. Some people are allergic to what the rest of us have no trouble at all with. One thought - If
Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef
Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the
Electronics Forum | Tue May 24 17:07:36 EDT 2005 | davef
Eric: For the amount of dross that you're removing, we're concerned that you could be loosing the balance of your solder alloy, because dross consists primarily of tin oxides. It has little lead in it, beyond than the lead content of the solder that
Electronics Forum | Fri Sep 09 15:02:29 EDT 2005 | russ
What are the Mfg specs for pad layout? I had one that was wrong and we changed the center to center spacing to .032" and the width to .015" wider (.0075" on each side)than the solder terminations and everything was fine. As a general rule I never t
Electronics Forum | Wed Feb 01 17:36:37 EST 2006 | Cal Kolokoy
Your method of only using solder paste to form the solder joint w/out collapsing the ball is very unconventional, just as others have mentioned on this thread. I bet you those joints will fail under thermal and mechanical stress. Have you done due
Electronics Forum | Thu Dec 01 21:30:31 EST 2005 | davef
Primary methods used to test assembled circuit boards are: * Automated test equipment [ATE] * Manual bench-top functional test equipment Assembled printed circuit board ATE market segments are: * In-circuit ATE * Functional ATE * Boundary Scan AT
Electronics Forum | Sat Dec 03 03:56:47 EST 2005 | hamidrezamaddah
Primary methods used to test circuit boards > are: * Automated test equipment [ATE] * Manual > bench-top functional test equipment > > Printed > circuit board ATE market segments are: * > In-circuit ATE * Functional ATE * Boundary > Scan ATE
