Electronics Forum | Fri May 22 16:00:54 EDT 2009 | pjc
Henkel- Hysol seems to be the most popular material that I see: http://www.henkel.com/cps/rde/xchg/SID-0AC83309-B331D246/henkel_com/hs.xsl/12169_20090505-henkel-launches-next-gen-underfill-20681_COE_HTML.htm As far as application method, its all ab
Electronics Forum | Mon Jan 17 14:03:45 EST 2005 | davef
There's a fair amount of information on underfilling CSP and flip chip in the web. Look here to get started: * http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf * http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID
Electronics Forum | Mon Jun 19 21:32:15 EDT 2000 | Dave F
Frank: Good luck on finding a specification. The right combination of material properties will greatly improve the lifetime of your flip chip component. Your flip chip supplier might be best starting place to determine underfill properties that ma
Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest
Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te
Electronics Forum | Mon May 29 04:02:51 EDT 2006 | vasily
Hi Efren Unfortunately I cannot say about prices, because I don't know them in your region. But I can offer you to consider the world-leader manufacturers of each type of equipment. I think you can obtain all information through their web-sites. We s
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