Electronics Forum | Fri Oct 23 12:38:34 EDT 2009 | kircchoffs
--the lead time for ENIG only 6 monnths and need do baking before use if those boards was expired. speaking of baking. what is the correct procedure? may i know the temps,time and profile? thanks
Electronics Forum | Wed Jun 24 18:50:31 EDT 2020 | premkumar_haribabu
Dear experts, We are in stage to fix lapse or hold time between pre-bake to reflow process ( SMT ) for flex-rigid PCB, usually for flex pcb , we need to assemble as early as possible once after baking & if not , we can store in humidifier up to some
Electronics Forum | Tue Jan 18 12:41:14 EST 2005 | paulom
I am having some problems with regard to soldering of PBGAs. In the factory had high humidity. Can I make Bake in different temperatures of 125 and 40 degrees? Which the minimum temperature? How many times I can effect bake without damaging the com
Electronics Forum | Wed Nov 20 16:53:18 EST 2002 | davef
Q1: How important is the bare PCB baking ? A1: Baking boards is a non-value added activity. Q2: What is the temperature for baking @ what RH ? A2: Search the fine SMTnet Arcives for bake recipes. Q3: What would be the impact for the ENTEK finishe
Electronics Forum | Wed Jul 11 22:48:54 EDT 2012 | joeion
It is correct to remove moisture in PCB by baking. But I think the time and temperature is too little. According to our experience, it should be more than 60min at 120 centigrade degrees.
Electronics Forum | Mon Jan 07 13:09:35 EST 2008 | stevek
As I told you, some carriers (trays) are limited > to 75 degree maximum, and from time to time > employees do not pay attention to this. This is > one of the reasons. The second reason is that 90 > degree still be problematic in a case of rebake
Electronics Forum | Fri Oct 01 09:32:25 EDT 2010 | mazjal7
Rob, thank you for input. I notice you mention a baking process for the flex circuits, this is our first time with flex assembly, do the flex circuits need to be baked prior SMT, Moisture? Thanks, David
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Fri Jul 30 17:22:48 EDT 1999 | Dave F
| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so
Electronics Forum | Wed Oct 14 04:01:28 EDT 1998 | Joakim Fagerlund
We have problems with achiveing a void free soldered joint when we seal different kind of packages (QFP,LCC and PGA) We think the problem partly is due to outgasing from the die-adhesive (silver-glass) Does anybody have any reccomendations what to d
