Electronics Forum | Tue Sep 07 17:12:34 EDT 2004 | davef
No one knows what type of board you use. So, assuming you're talking a fairly standard FR4. Q1a. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? A1a. We'd guess your board could take 250*C for may
Electronics Forum | Fri Jun 18 12:11:20 EDT 1999 | John Thorup
| A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po
Electronics Forum | Wed Nov 14 01:18:20 EST 2007 | reypal
How about your bare pcb handling? do you stuff smd component prior hand soldering? you can try to bake the pcb and then see if this problem still exist.
Electronics Forum | Tue May 25 12:43:00 EDT 2010 | jmedernach
I don't have experience with 1B73. I do have a ton of experience with CE-1155. There are a couple of gotchas with this material. First and foremost is that it HATES silicone residue. If the material is not sticking to parts and they aren't cerami
Electronics Forum | Tue Apr 06 17:01:24 EDT 2004 | davef
It doesn't make sense that contamination would form on your gold pads after prebake of 150C for 3 hrs. The contamination must have been there prior to the bake. Your description makes us think of solder mask bleed. Tell us about: * Solder mask * S
Electronics Forum | Sun Oct 29 22:41:29 EST 2006 | hanocete
We have a current problem on our packages after we bake it for 24 hrs prior BGA rework. Flux or white residues found on the connector leads and terminals that cause not contact problems during mating. Could you help us how to clean the fluxes properl
Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala
Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u
Electronics Forum | Wed Aug 12 12:32:56 EDT 1998 | Rich Croteau
Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple p
Electronics Forum | Fri Aug 12 03:54:03 EDT 2005 | Mika
Does the pcba:s comes directly from the assembly line, You are going to do rework on? If faulty pcba:s comes back from, let say a customer from outside or the pcba:s has been on Your shelf for some days/weeks, exposed to open environment (humidity in
Electronics Forum | Mon Jan 04 21:03:22 EST 2010 | cman
1) I'm not familiar with the acronym CAF. Could you spell that one out for me? 2)Why do you feel they need to be baked? Are they in a high humidity enviornment? the only time we bake is when we are dealing with moisture sensitive components. Do you b
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