Electronics Forum | Tue Mar 28 15:11:56 EST 2006 | GS
Hi MLC, did you profiled the BGA itself? I mean detect Temperatures on middle/central ball vs external ball and see how much is the delta Temperature. Best practice is to keep the delta T at minimum as possible especially on a so large BGA. Sure
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Mon Jul 10 12:07:20 EDT 2006 | CKH
Hi Folk, if i have already mounted a BGA ICs with Missing BGA Balls onto the board, what will the Missing BGA Balls look like in X-Ray (2D & 3D).... A Big Void or will it look the same as other BGA Balls? Appreciate your advice. Thks & Rdgs CKH
Electronics Forum | Mon Jul 10 12:20:50 EDT 2006 | SWAG
Should look like a void (light spot in the ball pattern). Might even not show much detail like a void does, could look more like the perimeter of the chip in the x-ray or the detail you see between balls in the x-ray. Depends on how good the shot i
Electronics Forum | Thu Aug 23 16:28:14 EDT 2007 | grics
I want to get a collective opinion from the forum... I was always under the impression that Humidity at SMT can be a disaster and can cause solder balls... But what about at the Wave/Selective solder? If every board or almost every board has solder
Electronics Forum | Wed Jan 09 13:39:48 EST 2008 | ck_the_flip
Mask finish is the #1 variable for micro-balling with wave and selective processes. The #2 variable is the Flux. There are some flux formulations out there who're known to have additives that virtually eliminate micro-balling. However, keep in min
Electronics Forum | Tue Mar 31 08:11:51 EDT 2009 | davef
Solder ball formation can be a significant problem if the balls get trapped in the smaller spaces between ceramic chip carriers and substrates or possibly between the leads of small pitch leaded ICs. The solder balls also reduce the solder volume ava
Electronics Forum | Thu Jul 16 22:02:01 EDT 2009 | tpappano
The manual says (paraphrasing) "If the ball screw needs lubrication, lubricate the ball screw". Not very helpful 8-) The various linear guides all have grease fittings, but I can not find any for the ball screws. Any advice from CSM84 users woul
Electronics Forum | Wed Nov 04 17:18:30 EST 2009 | davef
It will be very difficult to apply the proper amount of solder with a stencil to bump a ball that is the proper size. A low volume ball is less reliable than a customary sized ball. There are: * Reballing service providers * Reballing preforms * For
Electronics Forum | Sat Aug 21 02:08:00 EDT 2010 | isd_jwendell
I have noticed that the % metal content in the paste can also be directly correlated to solder balls (less metal, more balls). However, I also found differences between pastes from different manufacturers and the number of solder balls (identical boa
