Industry News | 2010-03-27 16:40:49.0
RANCHO SANTA MARGARITA, CA - Valor Computerized Systems, Inc., global provider of productivity improvement software across the printed circuit board manufacturing supply chain, announces that it will feature its latest software solutions in booth #2228 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.
Industry News | 2011-02-26 16:22:43.0
Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in Booth A04 at the upcoming BiTS™ Burn-In & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ.
Industry News | 2011-03-07 14:43:24.0
Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in its distributor, Tronic Electronics HK Ltd.'s, Booth 2452 Hall 2 at the upcoming Semicon China Exhibition. A new eight-page ZIP® Product Portfolio brochure will be available for the first time at the ECT CPG booth. ZIP® recently has been granted US Patent Number 7,862,391.
Industry News | 2012-06-11 18:32:49.0
Everett Charles Technologies’ (ECT) announces that it will highlight the new HyperCore in Booth #6557 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
Electronics Forum | Mon Nov 14 10:45:05 EST 2005 | kmeline
We seem to be having a lot of issues with solder not flowing to the end of surface pads especially on fine pitch. These are assemblies we have run in the past with few issues. The bareboard finishes do not look the best. Has anyone been experiencing
Electronics Forum | Mon Nov 14 12:23:56 EST 2005 | russ
What is the finish of the PCB? What type of paste are you using?
Electronics Forum | Mon Nov 14 14:59:32 EST 2005 | davef
Additional questions are: * Does the problem appear with pasted/soldered only boards, in addition to those with components? * What is the size of the unsoldered area? What is the size of the pad? * Where is the solder mask, relative to the pad? * Wha
Electronics Forum | Thu Jan 17 20:33:05 EST 2002 | ianchan
Hi, Can anyone help explain the benefits/disadvantages of bareboard pcb baking, as part of the pre-heat conditioning, before the bareboard pcb use in SMT production run? The pcb board is 200mm x 240mm panelized pcb board, and has 28 smaller pcb boa
Electronics Forum | Mon Jun 12 17:03:21 EDT 2006 | pjc
Its in the IPC 600 bare-board specification.
Electronics Forum | Thu Feb 10 04:37:29 EST 2000 | Wolfgang Busko
Russ: If it�s true that they have been reworked to HASL I guess that something went awefully wrong at that stage. If you have some bareboards left have them checked thoroughly. M2C Wolfgang
