Electronics Forum | Fri Jun 12 11:15:50 EDT 1998 | Ryan Jennens
Hey all! The wave solder warrior is back. I have found a flux which leave almost no residue (the least yet), but because of its super low solids content I absolutely cannot get topside fillets. The multi-layer, two sided board is on a pallet w
Electronics Forum | Wed May 20 10:00:00 EDT 1998 | EFData
The quick frame does work well with the DEK 265, but we feel that tensioning is user dependent and introduces variation into the process on an operator to operator basis. Also, because tensioning occurs only on two sides (instead of four) this also i
Electronics Forum | Mon Feb 23 13:21:03 EST 1998 | Gary Simbulan
Gary, Paladium Leads have been a win-lose proposition as far as I can tell. The vendors win because they don't have to deal with lead and get higher yields. The users lose because of extra engineering time involved with incorporating this on their
Electronics Forum | Mon Aug 06 10:08:55 EDT 2001 | davef
I like the blue search button better than the upper right search button, because it gives far greater hits that are more representative of the content of the forum. For example: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&&
Electronics Forum | Sun Mar 03 07:22:03 EST 2002 | rkey
Hi, We've got one CSM60 and one CSM60V! After searching for a long time i've found the CSM Toolbox (/10) for UFO FIles !! Now i want to connect those machine's to a PC but i've tried everyhing but it doesn't work !! Does someone have experiance wi
Electronics Forum | Tue May 28 13:46:27 EDT 2002 | Yannick
Hi, I know that this topic have been discuss before but I would like to know what kind of equipement do you use to check your BGA and to rework it? What should I look for before buying something. Some people said that is not a good thing to
Electronics Forum | Fri Jun 14 14:32:05 EDT 2002 | davef
There is no real reason why you shouldn�t use your current paste. Paste for printing usually is a coarser mesh than paste for dispensing. Dispensing paste is more expensive, because of the mesh and the packaging, but that doesn�t matter now. Compa
Electronics Forum | Sat Jun 15 22:39:05 EDT 2002 | edahi
well we can't paste the flip chip on its substrate because we are using flux...because this bare die yet...and the surface of the die flipped might be contaminated...also after chip attach and reflow the die is to be underfilled and if the die is pas
Electronics Forum | Sat Jun 15 22:49:23 EDT 2002 | edahi
well as usual this for flip chip however, this application uses ceramic substrates and the nearby area in which the splatter land on is the marking area (gold pad). We cannot hide this because the package is completed bare die, meaning no heatspread
Electronics Forum | Wed Nov 06 05:13:01 EST 2002 | Dreamsniper
Crystalline flux if it is really clear should not be a problem. We were using Amtech paste before and we have the same results. Sometimes we mistakenly see it as a dry joint because of the reflections from the lighting of our Metcal inspection system
